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Microstructure Of Electrodeposited Copper Foil: Discussion On The Mechanism Model Of Three-Dimensional Electrocrystallization, Ren-Zhi Liu, Ping-Ling Xie, Chong Wang

Journal of Electrochemistry

The manufacturing of electrolytic copper foil has attracted more and more attention with the extensive applications of printed circuit board and lithium battery. The industrial scale is still extending. Compared with the developments of electroplating equipment and electroplating process, there is limited research on the mechanism of electrodeposition. This paper summarizes the manufacturing process of electrodeposited copper foil and analyzes the differences of various electroplating parameters in different electrodeposited copper technologies, and points out the important role of electrodeposition current density in the formation of copper foil. By showing and comparing the microstructures of different electrodeposited copper foils, the influences …