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Improved Methods For Electroplating Cadmium Sulfide Thin Films, Brandon Kemp, Robert Engelken, Arif Raza, Wasim Aleem, Imran Khan, Chris Barber
Improved Methods For Electroplating Cadmium Sulfide Thin Films, Brandon Kemp, Robert Engelken, Arif Raza, Wasim Aleem, Imran Khan, Chris Barber
Journal of the Arkansas Academy of Science
We report improved methods for electroplating cadmium sulfide (CMS) films. Aprevious problem was cracking/flaking of films deposited from organic solutions of elemental sulfur; attempts to improve adhesion via bath additives reduced grain size. Aqueous baths of thiosulfate ions yield cadmium-richness at low T temperatures (T), long deposition times, and/or poor bath stability. Developments in our work to be discussed include (1) plating ofuniform, adherent, and stoichiometric CdS from tetraethylene baths of CdCl 2 and elemental sulfur at T >70° C with minimal cracking/flaking, (2) improved uniformity/ adherence by use of CdL>, and (3) swept voltage methods in aqueous thiosulfate …
Electrodeposition Of Copper Indium Sulfide Films From Organic Solutions, Arif Raza, Robert Engelken, Brandon Kemp, Imran Khan, Wasim Aleem, Chris Barber
Electrodeposition Of Copper Indium Sulfide Films From Organic Solutions, Arif Raza, Robert Engelken, Brandon Kemp, Imran Khan, Wasim Aleem, Chris Barber
Journal of the Arkansas Academy of Science
We report on organic solutions ofCuCl 2 ,InClg, and elemental sulfur for electrodepositing CuIn x Sv films. CuInS 2 and CuInSe 2 are promising solar cellmaterials; our work on CuInSg prefaces planned work on plating CuInSe 2 from nonaqueous solvents. Two promising solvent systems are (1) mixed propylcne carbonate and water and (2) mixed ethylene glycol, propionic acid, and water (Engelken et al., 1988). Gray-brown films ofCuInx Sy (nominally GuInS2 ) have been plated from both baths. Major problems include (1) reduction ofCu+2 to Cu and Cu x S by the solvent at high temperatures (T>l()0°C), hence depleting Cu+2,(2) …