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Full-Text Articles in Engineering
Reliability Of Lead-Free Solder Joints Under Combined Shear And Compressive Loads, Ian Bernander, Travis Dale, Yuvraj Singh, Ganesh Subbarayan
Reliability Of Lead-Free Solder Joints Under Combined Shear And Compressive Loads, Ian Bernander, Travis Dale, Yuvraj Singh, Ganesh Subbarayan
The Summer Undergraduate Research Fellowship (SURF) Symposium
In electronic assemblies, solder joints are used to create electrical connections, remove heat, and mechanically support the components. When an electronic device is powered on, the solder joints and the board they are attached to heat up, expanding at different rates. Due to the difference in expansion, shear stress is imposed on the solder joints. As the device is powered on and off, this shear stress can eventually fracture the solder joint, causing the device to fail. Therefore, to increase the lifespan of electronics, it is important to investigate the mechanical properties of solder alloys. The present study investigates how …
Experimental Study Of Breakage Of Particles Under Compression, Haoze Zhou, Niranjan Parab, Weinong W. Chen
Experimental Study Of Breakage Of Particles Under Compression, Haoze Zhou, Niranjan Parab, Weinong W. Chen
The Summer Undergraduate Research Fellowship (SURF) Symposium
Granular materials are used widely and can be seen in natural and industrial applications such as sand bags or pharmaceutical pills. During their manufacturing, processing, transport and use, granular materials are subjected to various kinds of loadings. If the amplitude of the loading is above the strength threshold, particles constituting granular materials may fracture. It is very important to understand the failure of particles under these loading conditions to prevent or control their failure during all stages of their manufacturing and use. Better characterization of the fracture behavior of particles composed of different materials and sizes will allow more precise …
Rheo-Piv Investigation Of Fracture And Self-Healing In A Triblock Copolymer Gel, Benjamin A. Helfrecht, Travis L. Thornell, Kendra A. Erk
Rheo-Piv Investigation Of Fracture And Self-Healing In A Triblock Copolymer Gel, Benjamin A. Helfrecht, Travis L. Thornell, Kendra A. Erk
The Summer Undergraduate Research Fellowship (SURF) Symposium
Physically associating polymer gels have shown the ability to heal after failure, making them promising candidates for various medical applications or consumer products. However, the processes by which these materials self-heal is not well-understood. This study seeks to explain the self-healing behavior of the triblock copolymer poly(methyl methacrylate)-poly(n-butyl acrylate)-poly(methyl methacrylate), or PMMA-PnBA-PMMA, by probing the material’s post-fracture behavior with rheometry and particle image velocimetry (PIV). The self-healing behavior was studied by deforming each gel in shear until failure multiple times with “recovery” periods in-between. PIV was used to verify the occurrence of each fracture in both time and space. Stress …
Bio-Inspired Helicoidal Composites: 3d Printing And Experiments, Michael E. Jones, Pablo Zavattieri, Nobphadon Suksangpanya
Bio-Inspired Helicoidal Composites: 3d Printing And Experiments, Michael E. Jones, Pablo Zavattieri, Nobphadon Suksangpanya
The Summer Undergraduate Research Fellowship (SURF) Symposium
Materials that are impact resistant enough for personal protection in sports, transport, and combat are not also lightweight, strong, tough, and impact tolerant. Nature can provide inspiration for novel materials that can meet these needs. The hierarchical composite of the stomatopod’s, or mantis shrimp’s, dactyl club has been shown to have high impact resistance and damage tolerance due to its helicoidal fiber reinforcement(1,2). Analyzing helicoidal composites of different pitch angles (angles between adjacent rows of fibers) under quasi-static, displacement-controlled loading has provided insights into the fracture mechanisms of the composite structure and how they affect the macroscopic properties of the …