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Full-Text Articles in Engineering
Advanced Organic Polymers For The Nanoscale Fabrication Of Fiber-Based Electronics Using The Electrospinning Technique, William Serrano Garcia
Advanced Organic Polymers For The Nanoscale Fabrication Of Fiber-Based Electronics Using The Electrospinning Technique, William Serrano Garcia
USF Tampa Graduate Theses and Dissertations
Electrospinning has become one of the most interesting techniques for fabricating nanofibers for multiple applications. The high surface-to-volume ratio nanofibers offer make the perfect structure for filters, sensors, and fiber-based electronics that could lead to a wide range of flexible electronics applications. This technique makes organic semiconducting polymers a promising alternative for single fiber electronics structures. Indeed, a wide variety of structures can be fabricated using electrostatic techniques for polymer manipulation from droplets, fibers, and coaxial structures. Although techniques such as electrospinning led the use of electrostatic forces to generate fibers of a precursor solution, electrospinning requires large enough polymer …
Mitigation Of Electromigration In Metal Interconnects Passivated By Ångstrom-Thin 2d Materials, Yunjo Jeong
Mitigation Of Electromigration In Metal Interconnects Passivated By Ångstrom-Thin 2d Materials, Yunjo Jeong
USF Tampa Graduate Theses and Dissertations
Electromigration in metal interconnects remains one of the most prominent challenges in the state-of-the-art semiconductor industry. A phenomenon defined as the momentum transfer from electrons in an electric current to the metal atoms in a conductor, electromigration creates voids and hillocks that ultimately cause failures in nanoelectronics due to short or open circuits. Additionally, electromigration induces undesirable diffusion of metal atoms into the dielectric material, forcing the need for a barrier material that can mitigate such adverse effects of the phenomenon. However, extremely tight dimensional control of modern transistor designs imposes reduced dimensions of the interconnects in order to accommodate …