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I-Line Exposure Capability For 6 Inch Wafers, Jerome Wandell
I-Line Exposure Capability For 6 Inch Wafers, Jerome Wandell
Journal of the Microelectronic Engineering Conference
The HIT Factory is currently in the development phase for a 6 inch sub-micron CMOS process. The addition of the Canon FPA-2000i1 stepper completes the necessary equipment required to perform a 6 inch photo process at HiT. The major focus of this project is to further the 6 inch photo process development, specifically to setup the exposure process for the first two levels (p-well and active) of the HIT test chip. TV pre-align mark number 2 and auto-align mark 20P-4F were added to all eleven levels of the HIT test chip layout around the originally designed pattern~ area. The revised …