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Electrolytic Plating Of Copper For Advanced Interconnects, Michael T. Myszka

Journal of the Microelectronic Engineering Conference

There is great interest in the semiconductor industry to move to copper for advanced interconnect processing. The purpose of this study was to develop an electroplating process so further studies in copper processing can be undertaken at R.LT. Electroplating was performed using the facilities available at the University of Rochester. This system utilizes a copper sulfate based electrolyte and an 8” wafer holder. In order to use the electroplating tool for four-inch wafers, a fixture was designed. Plating was performed on Si wafers coated with adhesion and seed layer of copper at varying current densities. Plated films were characterized for …