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Comparing The Performance Of Different Machine Learning Models In The Evaluation Of Solder Joint Fatigue Life Under Thermal Cycling, Jason Scott Ross

Dissertations and Theses

Predicting the reliability of board-level solder joints is a challenging process for the designer because the fatigue life of solder is influenced by a large variety of design parameters and many nonlinear, coupled phenomena. Machine learning has shown promise as a way of predicting the fatigue life of board-level solder joints. In the present work, the performance of various machine learning models to predict the fatigue life of board-level solder joints is discussed. Experimental data from many different solder joint thermal fatigue tests are used to train the different machine learning models. A web-based database for storing, sharing, and uploading …