Engineering Commons^™

Printed And Structurally Integrated Electronics For Air Force Applications, Daniel Berrigan, Benjamin Leever, Michael Durstock

Composites at Lake Louise (CALL 2015)

Both printed and flexible electronic systems promise to integrate functional devices into new form factors (e.g., structures or clothing) and environments. Of particular interest are the mechanically harsh environmental conditions to which military systems are sometimes exposed, which can be quite severe (i.e., upward of 100,000 G peak acceleration within 0.1 ms), and commercial off-the-shelf components are not designed to maintain functionality under such rugged conditions. The overarching aim of this project is to leverage the unique ability of additive manufacturing to digitally control materials properties in three dimensions to create multifunctional systems whose structure is ruggedized for mechanically these …