Engineering Commons^™

A Wide Bandgap Silicon Carbide (Sic) Gate Driver For High Temperature, High Voltage, And High Frequency Applications, Ranjan Raj Lamichhane

Graduate Theses and Dissertations

The potential of silicon carbide (SiC) for modern power electronics applications is revolutionary because of its superior material properties including substantially better breakdown voltage, power density, device leakage, thermal conductivity, and switching speed. Integration of gate driver circuitry on the same chip, or in the same package, as the power device would significantly reduce the parasitic inductance, require far less thermal management paraphernalia, reduce cost and size of the system, and result in more efficient and reliable electrical and thermal performance of the system.

The design of a gate driver circuit with good performance parameters in this completely new under-development …

Design And Fabrication Of Inverter And Rectifier Modules For Indirect Matrix Converter Applications, Saikishore Talakokkula

Graduate Theses and Dissertations

In power converter applications, silicon carbide (SiC) power semiconductor devices are preferred over their silicon counterparts due to many advantages such as wide bandgap, high junction temperatures and low on-state resistance. The SiC devices provide reduced conduction and switching losses. Due to the above mentioned advantages the power conversion efficiency of SiC devices is better compared to that of silicon (Si) devices.

This thesis studies the implementation of 1200V/17A Normally-off SiC JFETs for an indirect matrix converter (IMC) application. A discussion on the parasitic inductance optimization is presented based on the electromagnetic simulation results extracted from the Ansoft Q3D extractor. …

Design, Layout, And Testing Of A Silicon Carbide-Based Under Voltage Lock-Out Circuit, Michael Dalan Glover

Graduate Theses and Dissertations

Silicon carbide-based power devices play an increasingly important role in modern power conversion systems. Finding a means to reduce the size and complexity of these systems by even incremental amounts can have a significant impact on cost and reliability. One approach to achieving this goal is the die-level integration of gate driver circuitry with the SiC power devices. Aside from cost reductions, there are significant advantages to the integration of the gate driver circuits with the power devices. By integrating the gate driver circuitry with the power devices, the parasitic inductances traditionally seen between the gate driver and the switching …