Engineering Commons^™

Modeling Noise Coupling Between Package And Pcb Power/Ground Planes With An Efficient 2-D Fdtd/Lumped Element Method, Ting-Kuang Wang, Sin-Ting Chen, Chi-Wei Tsai, Sung-Mao Wu, James L. Drewniak, Tzong-Lin Wu

James K. Wu, M.D.

An efficient numerical approach based on the 2-D finite-difference time-domain (FDTD) method is proposed to model the power/ground plane noise or simultaneously switching noise (SSN), including the interconnect effect between the package and the print circuit board (PCB). The space between the power and ground planes on the package and PCB are meshed with 2-D cells. The equivalent R-L-C circuits of the via and the solder balls connecting the package and PCB can be incorporated into a 2-D Yee cell based on a novel integral formulation in the time domain. An efficient recursive updating algorithm is proposed to fit the …