Engineering Commons^™

Mems Fabrication Of A Peristaltic Pump, Nicholas Amendola

Journal of the Microelectronic Engineering Conference

No abstract provided.

Automated Droplet Manipulation Through Electrowetting On Dielectric For Solid-Phase Oligonucleotide Synthesis, Hee Tae An

Journal of the Microelectronic Engineering Conference

No abstract provided.

Morphological, Thermal And Oxygen Barrier Properties Plasticized Film Polylactic Acid, Kurniawan Yuniarto, Bruce A. Welt, Foliatini -, Hanafi -, Candra Irawan

Journal of Applied Packaging Research

Introducing plasticizer poly(ethylene glycol) (PEG400) was applied into poly(lactic acid) (PLA) to produce film matrix packaging by direct casting. Non mechanical properties were carried out plasticized PLA including morphology, crystallinity structure and degree, thermal properties and oxygen barrier properties. Plasticized PLA revealed improving surface structure of PLA film matrix form fractures and homogenous film were achieved at 5% PEG 400. Chromatogram PLA and plasticized PLA were categorized crystal structure an α-form crystal. Intercalated and exfoliated structure did not occur significantly due to dispersion PEG 400 in the matrix but indicated dispersion structure. Thermal properties did not improve plasticized PLA significantly …

Pollution Prevention In The Great Lakes Basin: Working With Pulp & Paper Manufacturers, Eugene Park

Journal of Environmental Sustainability

In response to growing concerns over persistent toxic substances in the Great Lakes, new initiatives are in place to address and mitigate pollutant loadings to these large natural waterbodies. With support from the U.S. Environmental Protection Agency and New York Department of Environmental Conservation, the New York State Pollution Prevention Institute (NYSP2I) worked with pulp & paper companies in the Great Lakes Basin in an effort to find solutions to reduce environmental impacts from this industry sector. Based on currently available EPA toolkits, NYSP2I developed and utilized an assessment tool called Lean, Energy, and Environment (LE2). Five different paper manufacturers …

Evaluation Of Stability Of Unit Loads For Tilt And Shock Events During Distribution, Jay Singh, Koushik Saha, Tyler Sewell

Journal of Applied Packaging Research

Initiatives to lightweight and reduce packaging materials to achieve sustainability goals have created unit load stability challenges in the transportation and handling of palletized packaged goods. Consequently, an increased focus is being placed on evaluating how current pre-shipment performance tests evaluate load stability. This study was undertaken to address the current need for establishing test methodologies towards observing a unit load’s overall stability during transportation and handling related activities commonly experienced in the distribution environment. With this goal, this study developed two test methods as well as apparatus/measuring tool to observe a palletized load’s overall stability. The experimentation involved unit …

The Advent Of University-Level Packaging Scholarship: The Time, The Place And The People, Diana Twede, Laura Bix

Journal of Applied Packaging Research

In 1952, Michigan State College (MSC), now Michigan State University (MSU), was the first university in the world to offer a Bachelor of Science degree in Packaging. Other universities had previously offered related courses like canning (as part of a food science degree) or military packaging (in wartime), but MSU was the first to propose packaging as its own academic field of scholarship.

Other universities followed, sharing faculty and curriculum models developed at MSU. As a result, graduates’ careers in packaging now have a higher professional status, and universities play a key role in developing our international community of packaging …

Damping Package Design Using Structural Corrugated Board, Qi Zhang, Katsuhiko Saito, Katsushige Nagaoka

Journal of Applied Packaging Research

Packaging is designed to protect products from shock and vibration during transport. In recent years, paper cushioning materials, such as corrugated board and pulp molded packaging, are being increasingly used because they are environmentally friendly and easy to recycle. However, because no efficient packaging-design method yet exists for paper cushioning material, packaging engineers must rely on previous experience and the so-called trial-and-error method to design packaging. One reason for this situation is that, for most cases, the paper cushioning material used for protective packaging has a complicated structure and deforms after being subjected to repetitive shock and vibration. To address …

Development Of Starch-Polyvinyl Alcohol (Pva) Biodegradable Film: Effect Of Cross-Linking Agent And Antimicrobials On Film Characteristics, Aniket Satish More, Chandani Sen, Madhusweta Das

Journal of Applied Packaging Research

To satisfy the need of developing eco-friendly flexible antimicrobial packaging film with minimum use of synthetic chemical ingredients, the present study examined the efficacy of citric acid (CA) as cross-linking agent and essential oils (EOs), viz., cinnamon essential oil (CEO) and oregano essential oil (OEO) as natural antimicrobials in corn starch-polyvinyl alcohol (CS-PVA) film. Compared to film prepared from filmogenic solution (FS) containing 75 kg CS+8.75 kg PVA+24.6 kg glycerol per m³ FS, film additionally containing CA at 0.07 kg/kg CS indicated 95% higher ultimate tensile strength (UTS) and 27% lower water vapor permeability (WVP). Film developed with incorporation …

Impact Of Mastering Engineering On Student Learning And Perceptions In A Strength Of Materials Course, Harry G. Cooke, Md Abdullah Al Faruque

Presentations and other scholarship

The impact of Mastering Engineering on student learning of key concepts in strength of materials has been assessed in this study by comparing homework and examination grades received by students who used Mastering to those from prior years when it was not used. Student perceptions of the effectiveness of Mastering for helping promote learning were obtained through weekly surveys that students completed about their use of the tutorials and videos. In addition, student ratings of teaching effectiveness and the accomplishment of course learning outcomes were evaluated to see if there were any impacts on student perceptions of the course. From …

Evaluation Boundary And Design Method For Insulating Packages, Liao Pan, Jun Wang, Lixin Lu

Journal of Applied Packaging Research

To evaluate the failure potential of insulated packaging to heat outside, a so-called evaluation boundary for insulating packages was proposed for designing and estimating insulating packages based on the heat transfer law between the environment and a packaged product through packaging. Three evaluation parameters were suggested for describing the failure mechanism of insulating packages. The validity of the presented evaluation boundary was verified by the experimental data. Finally, a new design method of insulating packages based on the boundary was proposed and an application example was performed as a demonstration. The results indicated that the three evaluation parameters (which are …

Development Of A Lfle Double Pattern Process For Te Mode Photonic Devices, Mycahya Eggleston

Journal of the Microelectronic Engineering Conference

No abstract provided.

Stochastic Adc Using Digital Standard Cells, Zachary Baltzer

Journal of the Microelectronic Engineering Conference

No abstract provided.

Stochastic Adc Using Standard Cells: Design, Implementation And Eventual Fabrication Of A 4.7-Bit Adc, Zachary Baltzer

Journal of the Microelectronic Engineering Conference

As process nodes shrink, analog design increasingly becomes difficult due to space, signal, and noise concerns. With highly synthesized digital design, analog design innovation lags as these specific considerations are to be accounted for. The analog to digital converter, proposed by Weaver et al., is a completely digital design relying on comparator offsets to produce a digital counter that tracks the difference between the input voltage and a reference voltage. To soon be fabricated on GlobalFoundry’s 130 nm CMOS process, the proposed 5-bit ADC uses approximately 90,000 transistors with 1,500 comparators and a full-adder tree consisting of 1,500 adders to …

Large Area Monolayer Doping Development, Brian Novak

Journal of the Microelectronic Engineering Conference

No abstract provided.

Large Area Monolayer Doping Development, Brian Novak

Journal of the Microelectronic Engineering Conference

No abstract provided.

Large Area Monolayer Doping Development, Brian Novak

Journal of the Microelectronic Engineering Conference

One of the challenges facing the semiconductor industry as the scale of transistors shrink into nanometer sizes is the creation of ultra-shallow junctions. Furthermore, device geometry is morphing from planar to 3-dimensional structures which increases the need for conformal ultra-shallow junctions. The industry has relied on ion implantation to push the boundary of semiconductor doping, however effects such as transient enhanced diffusion caused by lattice damaged by implantation have impeded the creation of the desired ultra-shallow junctions. A new technique known as monolayer doping is one strategy to help solve both ultra-shallow junction formation as well as conformal doping. Monolayer …

Ald Of Ferroelectric Hfo2 Thin Films, Casey J. Gonta

Journal of the Microelectronic Engineering Conference

No abstract provided.

Atomic Layer Of Deposition Of Ferroelectric Hfo2, Casey J. Gonta

Journal of the Microelectronic Engineering Conference

No abstract provided.

Atomic Layer Of Deposition Of Ferroelectric Hfo2, Casey J. Gonta

Journal of the Microelectronic Engineering Conference

Ferroelectric (FE) materials exhibit spontaneous polarization making them particularly attractive for non-volatile memory and logic applications. Recently, doped hafnium oxide has shown to be ferroelectric in nature expanding its applications to these areas of interest. Ferroelectricity has been reported in atomic layer deposition (ALD) of HfO2 with Al, Y, or Si dopants. Previous work at RIT demonstrated functional ferroelectric field effect transistors (FeFETs) using silicon doped HfO2 (Si:HfO2) as the gate dielectric.

The new addition of a Savannah ALD system at RIT has made deposition of doped HfO2 films possible. Recipes have been developed for deposition of aluminum doped HfO2 …

Development Of A Lfle Double Pattern Process For Te Mode Photonic Devices, Mycahya Eggleston

Journal of the Microelectronic Engineering Conference

As the popularity of photonic devices and their uses increases, reliable manufacturing processes will need to be developed to make them more cost effective. Many companies still utilize i-line lithography, with very robust processes. Photonic devices require feature sizes often too small to be fabricated on i-line tools, especially for TE mode devices. In order to fabricate these devices, a form of double patterning will need to be developed.

Proposed is a Litho-Freeze-Litho-Etch (LFLE) process that can achieve the feature sizes capable of fabricating TE mode photonic devices. This project encompasses design, development, and characterization of a LFLE process that …

Mgf2/Ta2o5 Anti Reflective Coating Multilayers For Amo Solar Cells, Dylan J. Mafrici

Journal of the Microelectronic Engineering Conference

No abstract provided.

Mgf2/Ta2o5 Anti Reflective Coating For 3rd Generation Solar Cells, Dylan J. Mafrici

Journal of the Microelectronic Engineering Conference

No abstract provided.

Mgf2/Ta2o5 Anti Reflective Coating For 3rd Generation Solar Cells, Dylan J. Mafrici

Journal of the Microelectronic Engineering Conference

A bi-layer anti reflection coating (ARC) composed of MgF2-Ta2O5 was designed using a rigorous mathematical approach and was experimentally tested on a commercial grade solar cell as a proof of concept that the coating can be applied to multi-junction solar cells. A reactive sputter process was used to sputter tantalum oxide and a thermal evaporation process was used for depositing magnesium chloride. The thickness values of each film were measured via profilometry, elipsometry, and reflectometry techniques. Elipsometry was also used to determine the film material’s respective index of refraction. Diffuse field reflectance measurements of each film were made using an …

Giant Magneto-Impedance Effect In Multilayer Thin Film Sensors, Sean H. Heinze

Journal of the Microelectronic Engineering Conference

No abstract provided.

Giant Magneto-Impedance Effect In Multilayer Thin Film Sensors, Sean H. Heinze

Journal of the Microelectronic Engineering Conference

Over the last couple of decades, the Giant Magneto-Impedance (GMI) effect has become a well-known phenomenon, especially for its use in magnetic field sensing applications. Discussed in this paper will be a comprehensive summary of the fundamental theory behind the GMI effect, as well as the design, fabrication, and test of multilayer thin film GMI sensors. In recent research, multilayer GMI sensors have been shown to obtain GMI sensitives ranging from 10 – 100 times more than that of currently in industry Giant Magnetoresistance (GMR) sensors, comparable to that of its bulk microwire counterpart. To investigate this, a tri-layer film …

Giant Magneto-Impedance Effect In Multilayer Thin Film Sensors, Sean H. Heinze

Journal of the Microelectronic Engineering Conference

No abstract provided.

Investigation Of Ald Dielectrics In Silicon Capacitors, Enri Marini

Journal of the Microelectronic Engineering Conference

No abstract provided.

Investigation Of Ald Dielectrics In Silicon Capacitors, Enri Marini

Journal of the Microelectronic Engineering Conference

The goal of this analysis is to scale aluminum oxide films deposited by ALD for use in transistor fabrication with silicon and silicon-germanium substrates and the two metals offer varying work functions for gate control on the transistor level. MOS capacitors were fabricated on six-inch silicon substrates consisting of aluminum-oxide (Al2O3) as the dielectric and aluminum as the gate metal. The Al2O3 was deposited using atomic layer deposition (ALD) with thicknesses of 15nm and 20nm, while the aluminum gate metal was DC sputter deposited containing thickness of approximately 1200 A° . Capacitance values were measured in order to back-calculate the …

Encapsulation For Igzo Thin Film Transistors, Julia Okvath

Journal of the Microelectronic Engineering Conference

No abstract provided.

Encapsulation Of Indium-Gallium-Zinc Oxide Thin Film Transistors, Julia Okvath

Journal of the Microelectronic Engineering Conference

No abstract provided.