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Full-Text Articles in Engineering
Dynamic Through-Silicon Via Clustering In 3d Ic Floorplanning For Early Performance Optimization, Sucheta Mohapatra
Dynamic Through-Silicon Via Clustering In 3d Ic Floorplanning For Early Performance Optimization, Sucheta Mohapatra
Dissertations and Theses
Through-silicon via (TSV)-based three-dimensional integrated circuits (3D ICs) are expected to be the breakthrough technology for keeping up with the scaling trends of Moore's law, while also offering the unique opportunity for functional diversification through heterogenous integration. TSVs are vertical metal interconnects enabling communication across stacked and thinned dies. The dramatic reduction in global wirelength and chip footprint in 3DICs, directly improves delay, device density, bandwidth and routing congestion. Even with the current maturation of TSV process, the roadmap for industry adoption of 3DICs remains largely uncertain due to lack of standardized 3D tools capable of handling the sheer complexity …
Facilitating Mixed Self-Timed Circuits, Alexandra R. Hanson
Facilitating Mixed Self-Timed Circuits, Alexandra R. Hanson
University Honors Theses
Designers constrain the ordering of computation events in self-timed circuits to ensure the correct behavior of the circuits. Different circuit families utilize different constraints that, when families are combined, may be more difficult to guarantee in combination without inserting delay to postpone necessary events. By analyzing established constraints of different circuit families like Click and GasP, we are able to identify the small changes necessary to either 1) avoid constraints entirely; or 2) decrease the likelihood of necessary delay insertion. Because delay insertion can be tricky for novice designers and because the likelihood of its requirement increases when mixing different …