Engineering Commons^™

Dynamic Through-Silicon Via Clustering In 3d Ic Floorplanning For Early Performance Optimization, Sucheta Mohapatra

Dissertations and Theses

Through-silicon via (TSV)-based three-dimensional integrated circuits (3D ICs) are expected to be the breakthrough technology for keeping up with the scaling trends of Moore's law, while also offering the unique opportunity for functional diversification through heterogenous integration. TSVs are vertical metal interconnects enabling communication across stacked and thinned dies. The dramatic reduction in global wirelength and chip footprint in 3DICs, directly improves delay, device density, bandwidth and routing congestion. Even with the current maturation of TSV process, the roadmap for industry adoption of 3DICs remains largely uncertain due to lack of standardized 3D tools capable of handling the sheer complexity …

Synthesis And Assessment Of Radiotherapy-Enhancing Nanoparticles, Hayden Winter

Dissertations and Theses

Radiation Therapy (RT) is a common treatment for cancerous lesions that acts by ionizing matter in the affected tissue, causing cell death. The disadvantage of RT is that it is most often delivered via an external beam of radiation which must pass through healthy tissues to reach the target site, ionizing matter within healthy tissues as well. To address this drawback, techniques are being developed for increasing RT-induced cell death in a target tissue while minimizing cell death in surrounding tissues. This effect is known as radiation dose enhancement or RT enhancement.

The approach to RT enhancement studied in this …