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Full-Text Articles in Engineering
Simulation And Measurement For Decoupling On Multilayer Pcb Dc Power Buses, Hao Shi, F. Yuan, Fei Sha, James L. Drewniak, Todd H. Hubing, Thomas Van Doren
Simulation And Measurement For Decoupling On Multilayer Pcb Dc Power Buses, Hao Shi, F. Yuan, Fei Sha, James L. Drewniak, Todd H. Hubing, Thomas Van Doren
Electrical and Computer Engineering Faculty Research & Creative Works
DC power bus decoupling of a multi-layer PCB is modeled by a combination of a lumped circuit model at low frequencies ( < 200 MHz), and a mixed-potential integral equation approach at high frequencies. In order to determine the lumped parameters of via interconnects, an effective procedure using a network analyzer has been developed to characterize the trace/via inductances/resistances. For an 8 inch × 10 inch ten-layer test board used in this study, the simulations show good agreement with the measurement. This method can lead to new design strategies of decoupling for multilayer PCB power buses.
Transient And Dynamic Average-Value Modeling Of Synchronous Machine Fed Load-Commutated Converters, Keith Corzine, S. D. Sudhoff, H. J. Hegner, D. E. Delisle
Transient And Dynamic Average-Value Modeling Of Synchronous Machine Fed Load-Commutated Converters, Keith Corzine, S. D. Sudhoff, H. J. Hegner, D. E. Delisle
Electrical and Computer Engineering Faculty Research & Creative Works
A new average-value model of a synchronous machine fed load-commutated converter is set forth in which the stator dynamics are combined with the DC link dynamics. This model is shown to he extremely accurate in predicting system transients and in predicting frequency-domain characteristics such as the impedance looking into the synchronous machine fed load-commutated converter. The model is verified against a detailed computer simulation and against a hardware test system, thus providing a three-way comparison. The proposed model is shown to be much more accurate than models in which the stator dynamics are neglected