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Missouri University of Science and Technology

1975

<p>Voltammetry<br />Copper -- Electrometallurgy<br />Copper -- Additives</p>

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Application Of Voltammetry To Copper Electrodeposition, Louis Francis Toth Jr. Jan 1975

Application Of Voltammetry To Copper Electrodeposition, Louis Francis Toth Jr.

Doctoral Dissertations

"A study was undertaken to determine the feasibility of using voltammetry and scanning electron microscopy techniques to characterize copper deposition from an acid-sulfate electrolyte. The main process variables investigated were temperature and addition agents (chloride ion, glue, separan or thiourea) at different concentrations, over a range of current densities. Cathodes employed were either polycrystalline titanium or copper. Some long-time copper deposits were also made using Ti cathodes and the orientations of these deposits were determined by x-ray diffraction.

Observations of copper crystals produced during voltammetry scans, on a Ti cathode, indicated that a characteristic morphology was associated with each type …