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Viscoelastic Model To Capture Residual Stresses In Heat Cured Dissimilar Adhesive Bonded Joints, Akshat Agha, Fadi Abu-Farha

Publications

The thermal loading during the curing process of an adhesive-bonded joint induces residual stresses in the joint, thereby affecting its performance. The problem becomes worse in the case of a multi-material joint involving varying coefficients of thermal expansion (CTE) for different parts. A novel approach was developed to model the properties of automotive grade structural adhesives during the heat curing process. The material model was divided into two components: curing kinetics model and viscoelastic mechanical model. The models were calibrated using experimental data from Differential Scanning Calorimetry (DSC) and Dynamic Mechanical Analysis (DMA) tests performed on an epoxy-based single-component adhesive. …