Open Access. Powered by Scholars. Published by Universities.®
Articles 1 - 3 of 3
Full-Text Articles in Engineering
Electroplating And Machining Of Silicon Carbide Wafers, Madeline Beth Thompson
Electroplating And Machining Of Silicon Carbide Wafers, Madeline Beth Thompson
Theses and Dissertations
Silicon carbide has many properties that make it a promising and desirable material for diverse applications. One such application for silicon carbide wafers is as a transparent cryogenic probe card. This thesis briefly describes the design of a probe card based on a silicon carbide wafer substrate. It includes a description of electroplating fundamentals and demonstrates the feasibility of electroplating copper onto a wafer for the formation of bond pads between the substrate and external PCB ring. The process for electroplating copper with good adhesion and quality based on metal alloy formation, current control, and materials selection is outlined. Results …
Microfabrication Of Silicon Carbide And Metallized Polymers Using A Femtosecond Laser, Joseph Taylor Eddy
Microfabrication Of Silicon Carbide And Metallized Polymers Using A Femtosecond Laser, Joseph Taylor Eddy
Theses and Dissertations
Femtosecond lasers deliver a high peak concentration of optical power while maintaining low average power. With an accompanying optical setup, this power can be focused and used for high-precision fabrication of metallized polymers via ablation, creating conductive structures on a thin film. These lasers can also be harnessed in tandem with hydrofluoric acid and the two-photon absorption principle to selectively etch silicon carbide, a very durable and machining-resistant semiconductor with desirable properties. This thesis presents improvements made to the Laser-Assisted Chemical Etching (LACE) technique and the ablation system. ��, the two- photon absorption coefficient of silicon carbide, is measured and …
Design Of A Transparent Cryogenic Silicon Carbide Probe Card With Tungsten Probe Tips, Ryan Beazer
Design Of A Transparent Cryogenic Silicon Carbide Probe Card With Tungsten Probe Tips, Ryan Beazer
Theses and Dissertations
DoD EO/IR applications continue to push imaging technology. Next generation advances require new material systems, novel device structures, as well as the improvement and development of read out integrated circuits. The common methodology used to assess devices and materials is to process test chip structures and focal plane arrays. Test chips have advantages over focal plane arrays; such as, variable area and stand alone devices and can be measured as a function of bias and temperature; however, focal plane arrays are the heart of the imager, but are measured through the read out integrated circuits, which can add complexity to …