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Full-Text Articles in Engineering
An Examination Of The Relationship Between Academic Dishonesty And Professional Behavior, Trevor S. Harding, Honor J. Passow, Donald D. Carpenter, Cynthia J. Finelli
An Examination Of The Relationship Between Academic Dishonesty And Professional Behavior, Trevor S. Harding, Honor J. Passow, Donald D. Carpenter, Cynthia J. Finelli
Materials Engineering
A number of recent studies have found correlations between academic dishonesty in higher education and unethical behavior in the work settings. However, these studies have not explored the causal relationship between the underlying factors that lead to this dishonesty. This realization, and apparently high levels of cheating among engineering students, has lead us to a research hypothesis that decision making patterns about academic cheating among engineering students are positively correlated with those individuals' decision making patterns about work place ethics and responsibility. To test our hypothesis, we have developed an exploratory survey that asks questions about the respondent's decisions during …
Effects Of Intermetallic Morphology At The Metallic Particle/Solder Interface On Mechanical Properties Of Sn-Ag-Based Solder Joints, H. Rhee, F. Guo, J. G. Lee, Katherine C. Chen, K. N. Subramanian
Effects Of Intermetallic Morphology At The Metallic Particle/Solder Interface On Mechanical Properties Of Sn-Ag-Based Solder Joints, H. Rhee, F. Guo, J. G. Lee, Katherine C. Chen, K. N. Subramanian
Materials Engineering
Mechanical incorporation of metallic particles in the Sn-Ag-based solder resulted in various intermetallic compound (IMC) morphologies around these particles during reflow. Unlike with the Ni particles, the IMCs formed around Cu and Ag particles are relatively insensitive to reflow profiles employed. The IMC formed around the Ni particles ranges from “sunflower” morphology to “blocky” morphology with increasing time and temperature above liquidus during the heating part of the reflow profile. Mechanical properties, such as simple shear strength and creep behavior, of these composite solders were affected by the IMC morphologies in the composite solders investigated. Sunflower-shaped IMC formed around an …
Formation And Growth Of Intermetallics Around Metallic Particles In Eutectic Sn-Ag Solder, J. G. Lee, Katherine C. Chen, K. N. Subrmanian
Formation And Growth Of Intermetallics Around Metallic Particles In Eutectic Sn-Ag Solder, J. G. Lee, Katherine C. Chen, K. N. Subrmanian
Materials Engineering
Incorporation of metallic particulate reinforcements in eutectic Sn-Ag solder results in the formation of intermetallic compounds (IMCs) along particulate/ solder interfaces with different morphologies. For instance, “sunflower” and “blocky faceted” IMC shapes have been observed around Ni particle reinforcements incorporated in the eutectic Sn-Ag solder matrix. The time and temperature above solder liquidus during the heating stage of the reflow process has been found to play a significant role in determining the IMC morphology in these Ni particulate-reinforced solders. Similar studies were carried out with Cu and Ag particulate reinforcements using the same solder matrix. The amount of heat input …
Semiconductor Wafer Processing System With Vertically-Stacked Process Chambers And Single-Axis Dual-Wafer Transfer System, Richard N. Savage, Frank S. Menagh, Helder R. Carvalheira, Philip A. Troiani, Dan L. Cossentine, Eric R. Vaughan, Bruce E. Mayer
Semiconductor Wafer Processing System With Vertically-Stacked Process Chambers And Single-Axis Dual-Wafer Transfer System, Richard N. Savage, Frank S. Menagh, Helder R. Carvalheira, Philip A. Troiani, Dan L. Cossentine, Eric R. Vaughan, Bruce E. Mayer
Materials Engineering
A semiconductor wafer processing system including a multi-chamber module having vertically-stacked semiconductor wafer process chambers and a loadlock chamber dedicated to each semiconductor wafer process chamber. Each process chamber includes a chuck for holding a wafer during wafer processing. The multi-chamber modules may be oriented in a linear array. The system further includes an apparatus having a dual-wafer single-axis transfer arm including a monolithic arm pivotally mounted within said loadlock chamber about a single pivot axis. The apparatus is adapted to carry two wafers, one unprocessed and one processed, simultaneously between the loadlock chamber and the process chamber. A method …
Niti - Magic Or Phase Transformation?, Katherine C. Chen
Niti - Magic Or Phase Transformation?, Katherine C. Chen
Materials Engineering
NiTi alloys possess exciting properties and are staples in materials demonstrations. The shape memory effect and superelasticity property of NiTi fascinate people, but actually require significant materials knowledge to fully understand the phenomena. A laboratory dealing with phase transformations was thus developed to capitalize on the allure of NiTi for a junior/senior level “Thermodynamics and Kinetics of Materials” course. Students examine and characterize the shape memory and superelastic properties of NiTi wire, and then realize the difference is in the transformation temperature (i.e., Af - the austenitic finish temperature). They then use the phase diagram and TTT diagram to develop …
How We Learned To Love The Phase Diagram With A Ti-Cr Alloy Characterization Lab, Katherine C. Chen
How We Learned To Love The Phase Diagram With A Ti-Cr Alloy Characterization Lab, Katherine C. Chen
Materials Engineering
While many students learn how to read and use a phase diagram in introductory materials courses, greater appreciation for such a tool can be garnered through the laboratory setting. A laboratory module for a “Structures of Materials” class (a “core class” for materials majors) has been developed to demonstrate the usefulness of phase diagrams, as well as, to emphasize the connections among processing, structure, and properties. Competence in determining stable phases, phase compositions, and mass fractions of phases are not the end goal, per se, but transpire since the skills are required to help solve a puzzle. Students are given …
Students' Perceptions Of Both The Certainty And The Deterrent Effect Of Potential Consequences Of Cheating, Cynthia J. Finelli, Trevor S. Harding, Donald D. Carpenter, Honor J. Passow
Students' Perceptions Of Both The Certainty And The Deterrent Effect Of Potential Consequences Of Cheating, Cynthia J. Finelli, Trevor S. Harding, Donald D. Carpenter, Honor J. Passow
Materials Engineering
No abstract provided.
Physical Metallurgy: Providing Unifying Principles In Diverse Areas Of Materials Engineering, Katherine C. Chen, Vilupanur A. Ravi
Physical Metallurgy: Providing Unifying Principles In Diverse Areas Of Materials Engineering, Katherine C. Chen, Vilupanur A. Ravi
Materials Engineering
No abstract provided.
Structural And Diffusional Effects Of Hydrogen In Tini, Alan R. Pelton, Christine Trépanier, Xiao-Yan Gong, Andreas Wick, Katherine C. Chen
Structural And Diffusional Effects Of Hydrogen In Tini, Alan R. Pelton, Christine Trépanier, Xiao-Yan Gong, Andreas Wick, Katherine C. Chen
Materials Engineering
Hydrogen can be inadvertently added to Nitinol medical devices through electropolishing, caustic cleaning, or exposure to other acidic or basic solutions. Moderately high hydrogen concentrations can lead to embrittlement characterized by lowered ductility and changes in transformation behavior. The purpose of the present report is to discuss recent results on the effects of hydrogen in annealed TiNi. Samples are charged with hydrogen and analyzed with x-ray diffraction; these data indicate that even relatively small amounts of hydrogen can affect the crystal structure. Additions of up to 1000 wppm hydrogen increase the atomic volume by more than 2%, decrease peak intensity …