Engineering Commons^™

Optimization Of Thermal Interface Materials For Electronics Cooling Applications, Vishal Singhal, Thomas Siegmund, Suresh V. Garimella

School of Mechanical Engineering Faculty Publications

Thermal interface materials (TIMs) are used in electronics cooling applications to decrease the thermal contact resistance between surfaces in contact. A methodology to determine the optimal volume fraction of filler particles in TIMs for minimizing the thermal contact resistance is presented. The method uses finite element analysis to solve the coupled thermo-mechanical problem. It is shown that there exists an optimal filler volume fraction which depends not only on the distribution of the filler particles in a TIM but also on the thickness of the TIM layer, the contact pressure and the shape and the size of the filler particles. …