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Melting And Resolidification Of A Substrate Caused By Molten Microdroplet Impact, Daniel Attinger, D. Poulikakos
Melting And Resolidification Of A Substrate Caused By Molten Microdroplet Impact, Daniel Attinger, D. Poulikakos
Daniel Attinger
This paper describes the main features and results of a numerical investigation of molten microdroplet impact and solidification on a colder flat substrate of the same material that melts due to the energy input from the impacting molten material. The numerical model is based on the axisymmetric Lagrangian Finite-Element formulation of the Navier–Stokes, energy and material transport equations. The model accounts for a host of complex thermofluidic phenomena, exemplified by surface tension effects and heat transfer with solidification in a severely deforming domain. The dependence of the molten volume on time is determined and discussed. The influence of the thermal …
An Experimental Study Of Molten Microdroplet Surface Deposition And Solidification: Transient Behavior And Wetting Angle Dynamics, Daniel Attinger, Z. Zhao, D. Poulikakos
An Experimental Study Of Molten Microdroplet Surface Deposition And Solidification: Transient Behavior And Wetting Angle Dynamics, Daniel Attinger, Z. Zhao, D. Poulikakos
Daniel Attinger
The basic problem of the impact and solidification of molten droplets on a substrate is of central importance to a host of processes. An important and novel such process in the area of micromanufacturing is solder jetting where microscopic solder droplets are dispensed for the attachment of microelectronic components. Despite the recent appearance of a few numerical studies focusing on the complex transient aspects of this process, no analogous experimental results have been reported to date to the best of our knowledge. Such a study is reported in this paper. Eutectic solder (63Sn37Pb) was melted to a preset superheat and …