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Quality Assessment Of Adhesive Bond Based On Dielectric Properties, Muthu Ram Prabhu Elenchezhian, Vamsee Vadlamudi, Priyanshu Kumar Banerjee, Chaitanya Dave, Anik Mahmood, Rassel Raihan
Quality Assessment Of Adhesive Bond Based On Dielectric Properties, Muthu Ram Prabhu Elenchezhian, Vamsee Vadlamudi, Priyanshu Kumar Banerjee, Chaitanya Dave, Anik Mahmood, Rassel Raihan
Institute of Predictive Performance Methodologies (IPPM-UTARI)
Composite materials are widely used in Aerospace, Marine and Automotive structures to reduce weight and increase performance. Adhesive bonding improves the stress distribution between the composite materials / dissimilar materials and ensures a lighter structure than conventional fastener joints. But still there is not much research on the Non-Destructive strength estimation and life prediction, or the damage prognosis of the adhesive bond. One of the main problems when using adhesive bonding is a "kissing bond" which is a weak adhesion bond alternatively called zero volume disbond. Typically, convectional non-destructive methods cannot detect this kissing bond. Broadband Dielectric Spectroscopy, BbDS, is …