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Full-Text Articles in Engineering
Research Progresses Of Cobalt Interconnect And Superfilling By Electroplating In Chips, Li-Jun Wei, Zi-Han Zhou, Yun-Wen Wu, Ming Li, Su Wang
Research Progresses Of Cobalt Interconnect And Superfilling By Electroplating In Chips, Li-Jun Wei, Zi-Han Zhou, Yun-Wen Wu, Ming Li, Su Wang
Journal of Electrochemistry
Copper interconnect using dual damascene technology has always been the main means for metallization in the back end of line process. However, with the size effect becoming more and more obvious due to feature size reduction, copper interconnect can no longer meet the demand for high circuit speed in Post-Moore era. Following copper interconnection, cobalt interconnection in chips attracts much attention as an interconnect technology by the next generation, which has been introduced in 7 nm node of integrated circuit manufacturing and below. The electron mean free path of cobalt (~10 nm) is much shorter than copper’s (39 nm), thus …
Preparation And Optical Transmission Of The Zno Nanorod Array Films, Feng Ye, Jing-Jing Li, Tong-Tao Wang, Yong-Liang Wang, Yun Liu, Xin-Dong Wang
Preparation And Optical Transmission Of The Zno Nanorod Array Films, Feng Ye, Jing-Jing Li, Tong-Tao Wang, Yong-Liang Wang, Yun Liu, Xin-Dong Wang
Journal of Electrochemistry
By using a galvaostatic electrodeposition method in the ZnCl2 solution,the highly oriented ZnO nanorod array films have been successfully prepared on ITO substrate after the pretreatment with ZnO nanoparticles.And they were characterized by scanning electron microscope,X-ray diffraction and transmittance spectra.The results indicated that the ZnO nanorod arrays grew along(001) direction with an orientation perpendicular to the substrate.When the wavelength of incident was over 380 nm,the ZnO nanorod arrays showed high optical transmission of above 95%.Furthermore,the band gap became narrower.