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Research And Application Of Copper Electroplating In Interconnection Of Printed Circuit Board, Chong Wang, Chuan Peng, Jing Xiang, Yuan-Ming Chen, Wei He, Xin-Hong Su, Yu-Yao Luo

Journal of Electrochemistry

Copper electroplating is the key technology for manufacturing of integrated circuit, packaging substrate, printed circuit board, and other electronic interconnection components. However, the electrochemistry and mechanism of deposition growth have not been fully elucidated, and the development of additives and bath maintenance are inseparable from a large number of experiments. This article reviews recent fundamental research and application progress in copper electroplating for printed circuit board industry, and these works are mainly dedicated by the research group of Printed Circuit and Printed Electronics from University of Electronic Science and Technology of China. First of all, a brief history of copper …