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Full-Text Articles in Engineering
Development Status Of Copper Electroplating Filling Technology In Through Glass Via For 3d Interconnections, Zhi-Jing Ji, Hui-Qin Ling, Pei-Lin Wu, Rui-Yi Yu, Da-Quan Yu, Ming Li
Development Status Of Copper Electroplating Filling Technology In Through Glass Via For 3d Interconnections, Zhi-Jing Ji, Hui-Qin Ling, Pei-Lin Wu, Rui-Yi Yu, Da-Quan Yu, Ming Li
Journal of Electrochemistry
With the slow development of Moore's Law, the high density and miniaturization of microelectronic devices put forward higher requirements for advanced packaging technology. As a key technology in 2.5D/3D packaging, interposer technology has been extensively studied. According to different interposer materials, it is mainly divided into organic interposer, silicon interposer and glass interposer. Compared with the through silicon via (TSV) interconnection, the through glass via (TGV) interposer has received extensive attention in the 2.5D/3D advanced packaging field for its advantages of excellent high-frequency electrical characteristics, simple process, low cost, and adjustable coefficient of thermal expansion (CTE). However, the thermal conductivity …
Research Progresses Of Copper Interconnection In Chips, Lei Jin, Jia-Qiang Yang, Fang-Zu Yang, Dong-Ping Zhan, Zhong-Qun Tian, Shao-Min Zhou
Research Progresses Of Copper Interconnection In Chips, Lei Jin, Jia-Qiang Yang, Fang-Zu Yang, Dong-Ping Zhan, Zhong-Qun Tian, Shao-Min Zhou
Journal of Electrochemistry
In this paper, the copper interconnection technology in chip manufacturing is introduced in detail, and the essentials of acidic copper sulfate electroplating process and the mechanisms of common-used additives are reviewed. The progresses of novel additives at home and abroad are also summarized. Based on the studied achievement, the possibility of the novel copper interconnect process replacing the acidic copper electroplating is prospected.