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Bond Strength Characterization Of Su-8 To Su-8 For Fabricating Microchannels Of An Electrokinetic Microfluidic Pump, Nash Anderson

Materials Engineering

Photosensitive negative resist polymer layers of SU-8 2050 were adhered to 100 mm n-type silicon and Pyrex wafers via spin coating. These wafers were then bonded together at various temperatures of 100 ͦC, 120 ͦC, 140 ͦC, 150 ͦC, 160 ͦC, and 180 ͦC. The target thickness of each SU-8 layer was 100 µm. Photolithography was used to create microfluidic channels within the SU-8. An n-type silicon wafer and a Pyrex wafer, each with an SU-8 layer, were brought together on the “hard bake” or final step of SU-8 polymerization. A pressure of ~300 KPa was applied during the hard …