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A. Copper; B. Cyclic Voltammetry; B. Polarization; B. Raman spectroscopy; C. Interfaces; C. Pourbaix diagram;
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Interfacial Corrosion Of Copper And The Formation Of Copper Hydroxychloride, Mary Teague, Shengxi Li, Hongbo Cong
Interfacial Corrosion Of Copper And The Formation Of Copper Hydroxychloride, Mary Teague, Shengxi Li, Hongbo Cong
Williams Honors College, Honors Research Projects
Electrical circuitry is an industry, among many others, heavily using the element of copper. Ensuring the mechanical integrity of Cu is crucial, especially in salt environments, for the multifaceted composition of circuits. 4N NaCl solution (equilibrium concentration in ~84% RH) simulated this three-phase system. Rectangular Cu samples were partially immersed in both ambient and continuous lab air sparging atmospheres to understand waterline corrosion of the metal. Open circuit potentials (OCP) were continuously taken during the immersion testing for a maximum of 5 days. A scanning electron microscopy (SEM) equipped with an energy dispersive X-ray spectrometer (EDS), Raman spectroscopy, and 3-D …