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Comparison Of Low-Temperature Co-Fired Ceramic And Direct Bonded Copper For Single Ended Primary Inductance Topology, Kristopher Cody Johnson
Comparison Of Low-Temperature Co-Fired Ceramic And Direct Bonded Copper For Single Ended Primary Inductance Topology, Kristopher Cody Johnson
Electrical Engineering Undergraduate Honors Theses
This work examines the thermal dissipation characteristics of Low-Temperature Co-fired Ceramic (LTCC) and Direct Bonded Copper (DBC) with the implementation of a Single Ended Primary Inductance Converter (SEPIC) topology. The advantages and disadvantages of the two substrates will be explored in addition to a description of the design and control of the SEPIC. It will be shown that the DBC implementation is superior with regards to thermal dissipation, but that LTCC has advantages in high- density packaging, RF applications, and embedded components. These substrates and converters provide many advantages in industrial applications that include automotive and grid level implementations. Additional …
Analysis Of Portable Charging Systems For Mobile Devices Utilizing Today's Technology, Dylan Ashley
Analysis Of Portable Charging Systems For Mobile Devices Utilizing Today's Technology, Dylan Ashley
Electrical Engineering Undergraduate Honors Theses
With the progression of technological advances, electronic devices are becoming increasingly smaller while simultaneously becoming increasing powerful. Consumer demand for a cheaper, longer lasting battery life challenges today’s engineers to continually develop a battery and its circuitry with increasing efficiency without compromising performance. Developing an affordable, efficient external battery pack has been the marketable solution, but the question is whether or not the existing external battery packs available are meeting the wants and desires of the end consumer. The answer is partially in that my research confirms that the current solution is not ideal; however, efficiency has been increased as …