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Full-Text Articles in Engineering
Plasma-Enhanced Atomic Layer Deposition Of Ruthenium-Titanium Nitride Mixed-Phase Layers For Direct-Plate Liner And Copper Diffusion Barrier Applications, Adam James Gildea
Plasma-Enhanced Atomic Layer Deposition Of Ruthenium-Titanium Nitride Mixed-Phase Layers For Direct-Plate Liner And Copper Diffusion Barrier Applications, Adam James Gildea
Legacy Theses & Dissertations (2009 - 2024)
Current interconnect networks in semiconductor processing utilize a sputtered TaN diffusion barrier, Ta liner, and Cu seed to improve the adhesion, microstructure, and electromigration resistance of electrochemically deposited copper that fills interconnect wires and vias. However, as wire/via widths shrink due to device scaling, it becomes increasingly difficult to have the volume of a wire/via be occupied with ECD Cu which increases line resistance and increases the delay in signal propagation in IC chips. A single layer that could serve the purpose of a Cu diffusion barrier and ECD Cu adhesion promoter could allow ECD Cu to occupy a larger …
Plasmonic-Based High Temperature Chemical Sensing Using Gold Nanoparticles Embedded In Metal Oxide Thin Films, Nicholas Joy
Plasmonic-Based High Temperature Chemical Sensing Using Gold Nanoparticles Embedded In Metal Oxide Thin Films, Nicholas Joy
Legacy Theses & Dissertations (2009 - 2024)
Thin metal oxide films embedded with Au nanoparticles (AuNPs) have been investigated as high temperature localized surface plasmon resonance (LSPR) based sensing materials to monitor H2, CO, and NO2 at a temperature of 500°C. Applications for this technology include turbine engines as well as other combustion environments where it is important to monitor emission gases for both regulatory purposes as well as combustion control. These high temperature applications, which may be oxidizing or reducing in nature, present challenges to sensor reliability and selectivity, and have therefore necessitated the development of novel sensing devices. While there has been …