Engineering Commons^™

Grain Boundary Motion Analysis, Jeremy Marquardt, Xiaorong Cai, Marisol Koslowski

The Summer Undergraduate Research Fellowship (SURF) Symposium

Grain growth is a mechanism to relax residual stresses in thin films. These grains grow out of the thin film surface and are known as whiskers. These whiskers can cause short circuits, so developing scalable and cost effective solutions would increase the reliability and utility of tin electronics. A popular of method of examining tin whiskering is microscopic simulation, as it provides an accurate and cost effective way to predict the consequences of proposed models. Specifically examining the evolution of grain boundaries, this paper aims to present the results of grain boundary motion simulations through a generalized program that streamlines …