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Full-Text Articles in Engineering
Solder Ball Reliability Assessment Of Wafer Level Chip Scale Package (Wlcsp) Through Power Cycling, Bhavna Conjeevaram
Solder Ball Reliability Assessment Of Wafer Level Chip Scale Package (Wlcsp) Through Power Cycling, Bhavna Conjeevaram
Mechanical and Aerospace Engineering Theses
Failure analysis and its effects are major reliability concerns in electronic packaging. More accurate fatigue life prediction can be obtained after the consideration of all affecting loads on the electronic devices. When an electronic device is turned OFF and then turned ON multiple times, it creates a loading condition called Power Cycling. The die is the main heat source causing non-uniform temperature distribution. The solder ball reliability assessment of wafer level chip scale package (WLCSP) is done through computational methods such as Finite element analysis. WLCSPs use wafer level package technology which is an extension of the Wafer Fab process, …
Efficient Time-Dependent System Reliability Analysis, Zhifu Zhu
Efficient Time-Dependent System Reliability Analysis, Zhifu Zhu
Doctoral Dissertations
"Engineering systems are usually subjected to time-variant loads and operate under time-dependent uncertainty; system performances are therefore time-dependent. Accurate and efficient estimate of system reliability is crucial for decision makings on system design, lifetime cost estimate, maintenance strategy, etc. Although significant progresses have been made in time-independent reliability analysis for components and systems, time-dependent system reliability methodologies are still limited. This dissertation is motivated by the need of accurate and effective reliability prediction for engineering systems under time-dependent uncertainty. Based on the classic First and Second Order Reliability Method (FORM and SORM), a system reliability method is developed for multidisciplinary …
The Evaluation Of Sequential Optimization And Reliability Analysis, Guannan Liu
The Evaluation Of Sequential Optimization And Reliability Analysis, Guannan Liu
Masters Theses
"Sequential Optimization and Reliability Assessment (SORA) has been used for more than one decade for reliability-based design (RBD), but comprehensive theoretical studies on its performance have not been conducted. Further investigations on its performance are still needed. The objective of this thesis is to evaluate the performance of SORA for various testing problems. The performance of SORA evaluated in this thesis includes (1) accuracy, (2) efficiency, and (3) convergence behavior or robustness with numerical testing problems. SORA is evaluated with comparison with other major RBD methodologies. The testing problems are in different scales (numbers of design variables, random variables, and …