Engineering Commons^™

Thermal Design Of Three-Dimensional Electronic Assemblies, Yifan Weng, Chun-Pei Chen, Ganesh Subbarayan

The Summer Undergraduate Research Fellowship (SURF) Symposium

Currently, three-dimensional electronic assemblies (3D Packages) are a key technology for enabling heterogeneous integration and “more than Moore” functionality. A critical bottleneck to the viability of 3D Packages is their thermal design. Traditionally, heat spreaders are used as a passive method to reduce the peak temperature as well as temperature gradient on the chip. However, heat spreaders by themselves are often insufficient in stacked, multiple-die containing 3D Packages. Towards this end, to more efficiently remove heat, silicon interposers with through silicon vias (TSV) are used. However, careful design of number and location of TSVs is necessary. In addition, the heat …