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Full-Text Articles in Engineering
Capabilities Of Sintered Silver As A High Temperature Packaging Material, Bakhtiyar Mohammad Nafis
Capabilities Of Sintered Silver As A High Temperature Packaging Material, Bakhtiyar Mohammad Nafis
Graduate Theses and Dissertations
With electrification progressing across many sectors including industry, automotive and aerospace, the power density requirements are changing. The increased power density results in higher and higher ambient temperatures that electronics are exposed to. The response has been to move towards wide bandgap (WBG) semiconductor devices that can withstand much greater temperatures and can operate at much higher voltages than silicon. Additionally, these WBG devices deliver low drain-source on resistance (RDS_on) capabilities, enabling high current power modules that increase power density even further. This also requires the packaging to evolve in order to withstand the new requirements. As a result, researchers …
Combined Stressors In Reliability Failure Modes In Flip-Chip Electronic Packaging, Mahsa Montazeri
Combined Stressors In Reliability Failure Modes In Flip-Chip Electronic Packaging, Mahsa Montazeri
Graduate Theses and Dissertations
The trend toward miniaturization of electronic devices to fulfill Moore’s law introduces new reliability concerns to the electronic packaging process while worsening existing primary challenges. In solder interconnect specifically, temperature cycling is one of the prominent failure threats. However, with further downscaling of the flip-chip solder connections, electromigration also present a precarious failure mode in these interconnects. On the other hand, understanding the degradation mechanism in solders is crucial for the power electronic products' reliability considering the industrial tendency to replace wirebonds with solder attachment while improving the current carry capacity. This dissertation utilizes FEA simulation and an experimental approach …
Mission Profile Effects On Automotive Drivetrain Electronics Reliability: Modeling And Mitigation, Bakhtiyar Mohammad Nafis
Mission Profile Effects On Automotive Drivetrain Electronics Reliability: Modeling And Mitigation, Bakhtiyar Mohammad Nafis
Graduate Theses and Dissertations
The reliability of electronic devices is dependent upon the conditions to which they are subject. Temperature variations coupled with differences in thermal expansion between bonded materials results in thermomechanical stresses to build up, which can instigate failure in the interconnects or other critical regions. With the move towards electrification in the automotive industry, there is the increasingly important consideration of powertrain electronics reliability, the pertinent conditions being governed by the drive cycle or mission profile of the vehicle. The mission profile determines the power dissipated by the electronic devices, which determines the peak and mean temperature, temperature swing and the …
High Temperature Degradation In Gan-Based Hall Effect Sensors, Alexis Anne Krone
High Temperature Degradation In Gan-Based Hall Effect Sensors, Alexis Anne Krone
Graduate Theses and Dissertations
This research focuses on understanding the effects of accelerated aging through temperature and environment on novel gallium nitride-based Hall effect magnetic field sensors and determining device reliability under electric vehicle operating conditions. The device reliability was modeled using accelerated aging for the temperatures of 200 °C, 350 °C, 450 °C, and 600 °C under various time steps unique to each temperature and either air, which is identical to operating circumstances, or argon, which would model the hermetic packaging environment. Using a high temperature furnace and oven, devices underwent high temperature storage tests at a chosen temperature and time step. Afterwards, …
Development Of A Rapid Fatigue Life Testing Method For Reliability Assessment Of Flip-Chip Solder Interconnects, Cody Jackson Marbut
Development Of A Rapid Fatigue Life Testing Method For Reliability Assessment Of Flip-Chip Solder Interconnects, Cody Jackson Marbut
Graduate Theses and Dissertations
The underlying physics of failure are critical in assessing the long term reliability of power packages in their intended field applications, yet traditional reliability determination methods are largely inadequate when considering thermomechanical failures. With current reliability determination methods, long test durations, high costs, and a conglomerate of concurrent reliability degrading threat factors make effective understanding of device reliability difficult and expensive. In this work, an alternative reliability testing apparatus and associated protocol was developed to address these concerns; targeting rapid testing times with minimal cost while preserving fatigue life prediction accuracy. Two test stands were fabricated to evaluate device reliability …