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Full-Text Articles in Engineering
Design, Fabrication, And Reliability Effects Of Additively Manufactured First Level Compliant Interconnects For Microelectronics Application, Tumininu David Olatunji
Design, Fabrication, And Reliability Effects Of Additively Manufactured First Level Compliant Interconnects For Microelectronics Application, Tumininu David Olatunji
Graduate Theses and Dissertations
Semiconductor packaging and development is greatly dependent on the magnitude of interconnect and on-chip stress that ultimately limits the reliability of electronic components. Thermomechanical related strains occur because of the coefficient of thermal expansion mismatch from different conjoined materials being assembled to manufacture a device. To curb the effect of thermal expansion mismatch between conjoined parts, studies have been done in integrating compliant structures between dies, solder balls, and substrates. Initial studies have enabled the design and manufacturing of these structures using a photolithography approach which involves a high number of fabrication steps depending on the complexity of the structures …
The Effect Of Process Parameters And Surface Condition On Bond Strength Between Additively Manufactured Components And Polymer Substrates, Bharat Bhushan Chivukula
The Effect Of Process Parameters And Surface Condition On Bond Strength Between Additively Manufactured Components And Polymer Substrates, Bharat Bhushan Chivukula
Graduate Theses and Dissertations
Additive patching is a process in which printers with multiple axes deposit molten material onto a pre-defined surface to form a bond. Studying the effect of surface roughness and process parameters selected for printing auxiliary part on the bond helps in improving the strength of the final component. Particularly, the influence of surface roughness, as established by adhesion theory, has not been evaluated in the framework of additive manufacturing (AM). A full factorial design of experiments with five replications was conducted on two levels and three factors, viz., layer thickness, surface roughness, and raster angle to examine the underlying effects …