Open Access. Powered by Scholars. Published by Universities.®
Articles 1 - 3 of 3
Full-Text Articles in Engineering
Low Reynolds Number Flow Through Nozzle-Diffuser Elements In Valveless Micropumps, Vishal Singhal, Jayathi Y. Murthy, S V. Garimella
Low Reynolds Number Flow Through Nozzle-Diffuser Elements In Valveless Micropumps, Vishal Singhal, Jayathi Y. Murthy, S V. Garimella
CTRC Research Publications
Flow characteristics of low Reynolds number laminar flow through gradually expanding conical and planar diffusers were investigated. Such diffusers are used in valveless micropumps to effect flow rectification and thus lead to pumping action in one preferential direction. Four different types of diffuser flows are considered: fully developed and thin inlet boundary layer flows through conical and planar diffusers. The results from the numerical analysis have been quantified in terms of pressure loss coefficient. The variation of pressure loss coefficient with diffuser angle is presented for Reynolds numbers of 200, 500 and 1000. The pressure loss coefficients have been used …
Remotely Accessible Solar Energy Laboratory For High School Students, William J. Hutzel, David Goodman
Remotely Accessible Solar Energy Laboratory For High School Students, William J. Hutzel, David Goodman
School of Engineering Technology Faculty Publications
A remotely accessible solar energy laboratory has been developed for real-time experimentation using solar heating and photovoltaic equipment that is physically located at Purdue University. Indiana high school students are the first customers for this on-line resource. In addition to sensor data, the web-based laboratory includes lesson plans, tutorials, assessment questions, and a feedback utility. This project is helping science teachers meet new state science standards from the Indiana Department of Education, which call for hands-on laboratory activities and real time data analysis. Remotely accessed labs are becoming popular because they offer the opportunity for large numbers of students to …
Optimization Of Thermal Interface Materials For Electronics Cooling Applications, Vishal Singhal, Thomas Siegmund, Suresh V. Garimella
Optimization Of Thermal Interface Materials For Electronics Cooling Applications, Vishal Singhal, Thomas Siegmund, Suresh V. Garimella
School of Mechanical Engineering Faculty Publications
Thermal interface materials (TIMs) are used in electronics cooling applications to decrease the thermal contact resistance between surfaces in contact. A methodology to determine the optimal volume fraction of filler particles in TIMs for minimizing the thermal contact resistance is presented. The method uses finite element analysis to solve the coupled thermo-mechanical problem. It is shown that there exists an optimal filler volume fraction which depends not only on the distribution of the filler particles in a TIM but also on the thickness of the TIM layer, the contact pressure and the shape and the size of the filler particles. …