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Electrodeposition Of Nano-Sb-Zn Alloy In Acetamide-Urea-Nabr-Kbr Melt, Peng Liu, Xin-Ai Guo, Ye-Xiang Tong, Qi-Qin Yang
Electrodeposition Of Nano-Sb-Zn Alloy In Acetamide-Urea-Nabr-Kbr Melt, Peng Liu, Xin-Ai Guo, Ye-Xiang Tong, Qi-Qin Yang
Journal of Electrochemistry
The electroreduction of Zn(II) and Sb(III) in acetamide-urea-NaBr-KBr(343 K) were studied by cyclic volatmmetry.The reduction of Zn(II) or Sb(III) to the metals is an irreversible process.The transfer coefficient of Zn(II)+2e→Zn and Sb(III) +3e→Sb were calculated to be 0.231 and 0.319,the diffusion coefficient of Zn(II) and Sb(III) in the melt were determined as 1.70 10~(-6) and 3.21 10~(-6) cm~(2)· s~(-1) respectively.The Zn-Sb films with different Zn content from 29.67 at% to 97.34 at% were electrodeposited in acetamide-urea-NaBr-KBr melt at 343 K by controlling the deposition potential and the Zn(II)/Sb(III) molar ratio.The morphology of Zn-Sb film was observed by SEM.Zn-Sb film comprises …
Study On The Microstructure Of Pb-Sn Alloy Obtained From Quasi-Two-Dimensional Electrodeposition, Bin Sun
Study On The Microstructure Of Pb-Sn Alloy Obtained From Quasi-Two-Dimensional Electrodeposition, Bin Sun
Journal of Electrochemistry
A two-layered structure of eutectic-solid sulotion is formed in the microstructure of Pb-Sn alloy obtained from quasi-two-dimensional electrodeposition.It is showed that this unique structure is caused by the variation of the current density on the growth interface.When the interface is located in the front of the whole deposits,the current density is high.So the Pb and Sn can deposit together and the eutectic texture forms.When the interface is in the rear of the whole deposits,the current density is low.At this moment the electrodeposition of Pb is the dominant reaction,and the Pb-based solid solution appears.
Electrodeposition Of Three-Dimensional Porous Copper Films Using Hydrogen Bubbles As Template, Ya-Feng Sun, Zhen-Jiang Niu
Electrodeposition Of Three-Dimensional Porous Copper Films Using Hydrogen Bubbles As Template, Ya-Feng Sun, Zhen-Jiang Niu
Journal of Electrochemistry
Using cathodic hydrogen bubbles as a template,the three-dimensional(3-D) porous copper films have been successfully electrodeposited from a bath of 0.2 mol·dm~(-3) CuSO_(4) and 1.5 mol·dm~(-3) H_(2)SO_(4),effects of deposition parameters including temperature,current density and additives(Na_(2)SO_(4),HCl and Polyethylene glycol(PEG)) on the morphologies of the deposits have been systematically studied.SEM results showed that both the pore size and thickness of the pore walls decreased with cooling the electrolyte temperature or adding(Na_(2)SO_(4)) or PEG into the bath when the other deposition parameters were fixed.With addition small amounts of HCl in the bath,the wall structures of the films could be profoundly changed by refining the …