Engineering Commons^™

Development Of Lead-Free Thick Film Resistor, Xudong Chen

FIU Electronic Theses and Dissertations

Thick film resistors (TFRs) are widely used in hybrid microelectronics. Currently most of the resistor paste products contain lead, which is potentially a major problem to the environment resulting from electronics disposal. The purpose of this study is to develop a lead-free thick film resistor that is compatible to the typical industry thick film processing and has comparable electrical properties as the lead bearing counterpart. The research started from and focused on evaluation and selection of suitable lead-free glass material, which is one of the most important ingredients in a thick film resistor. The fired resistors were characterized in terms …

Synthesis And Investigation Of Highly Conductive Cu-Cr-Mwcnt Composites, Puneet K. Singh Gill

FIU Electronic Theses and Dissertations

There is great demand for contact materials with superior electrical and thermal conductivities and mechanical strength, for use in Vacuum Circuit Breakers (VCB). Copper (Cu) and chromium (Cr) alloy, developed in the 1970’s [1] has been the most common contact material in VCBs. Although Cu-Cr alloys possess good conductivity and mechanical properties, 50% of Cr (a strategic metal) in the alloy is resource prohibitive. A reduction in Cr usage without compromising desired properties is desirable.

Previous researchers focused on developing Cu-Cr alloys with fine and uniform microstructure to enhance their physical properties. This investigation focused on the development of a …

Synthesis Of Copper Carbon Nanotube Composite And Its Electrical Conductivity Measurement, Sushma Amruthaluri

FIU Electronic Theses and Dissertations

The matrices in which Multi Walled Carbon Nanotubes (MWCNTs) are incorporated to produce composites with improved electrical properties can be polymer, metal or metal oxide. Most composites containing CNTs are polymer based because of its flexibility in fabrication. Very few investigations have been focused on CNT-metal composites due to fabrication difficulties, such as achievement of homogeneous distribution of MWCNTs and poor interfacial bonding between MWCNTs and the metal matrix. In an effort to overcome poor interfacial bonding for the Cu - MWCNT composite, silver (Ag) and nickel (Ni) resinates have been incorporated in the ball milling stage. Composites of MWCNT …