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Full-Text Articles in Engineering
Copper Electrodeposition Under The Perturbation Of Hard Particles, Zeng-Wei Zhu, Di Zhu
Copper Electrodeposition Under The Perturbation Of Hard Particles, Zeng-Wei Zhu, Di Zhu
Journal of Electrochemistry
Copper electrodepositon was carried out on the rotating cathode,with hard particles(such as ceramic beads) filling between the electrodes.The rotation of cathode led hard particles to polish and impact the surface of deposit during electrodeposition.Copper deposits with a mass of cuspidal nodules were produced in acid sulfate solutions while brittle deposits without nodules were produced in alkaline sulfate solutions.It was also found that brightening and smoothing deposit could be obtained from the alkaline solution,and the deposit was approximatively disordered orientation with granular morphology of about 100~300 nm.The results show that the polishing and impact of hard particles can effectively disturb the …
Development Of Palladium Nanowires, Chuanding Cheng
Development Of Palladium Nanowires, Chuanding Cheng
Doctoral Dissertations
Inherent limitations of traditional lithography have prompted the search for means of achieving self-assembly of nano-scale structures and networks for the next generation of electronic and photonic devices. The nanowire, the basic building block of a nanocircuit, has recently become the focus of intense research. Reports on nanowire synthesis and assembly have appeared in the scientific literature, which include Vapor-Liquid-Solid mechanism, template-based electrochemical fabrication, solvothermal or wet chemistry, and assembly by fluid alignment or microchannel networks. An ideal approach for practical application of nanowires would circumvent technical and economic constraints of templating. Here we report on the self-assembly of highly-ordered …
A Conjugate Dissolution / Deposition Behavior In Thin Layer Electrodeposition, Sun Bin
A Conjugate Dissolution / Deposition Behavior In Thin Layer Electrodeposition, Sun Bin
Journal of Electrochemistry
During the electrodeposition of lead, the dendrite deposit segregates from the cathode due to the disturbance of hydrogen gas. The segregated deposit could move toward the anode spontaneously rather than keep stationary. The studies show that this novel phenomenon was caused by the conjugate electrodissolution and electrodeposition reactions taking place at two ends of the isolated segment of the deposit. The mechanism inducing this phenomenon is suggested.