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The Effect Of Sample Placement In The Furnace During The Heat Treatment Process Of 7075-T6 Aluminum Alloy On Microstructure, Hardness, And Electrical Conductivity, Donanta Dhaneswara, Hardi Rindharto, Muhammad Syauqi Aqilafif
The Effect Of Sample Placement In The Furnace During The Heat Treatment Process Of 7075-T6 Aluminum Alloy On Microstructure, Hardness, And Electrical Conductivity, Donanta Dhaneswara, Hardi Rindharto, Muhammad Syauqi Aqilafif
Journal of Materials Exploration and Findings
This paper reports the effects of sample placement during the heat treatment on the microstructural morphology and mechanical properties of 7075 Al alloy such as hardness value and electrical conductivity. The material was in the formed of Al alloy sheets where samples were machined into a square with dimensions of 1.5 x 1.5 inch. The 7075-T0 Al alloy as samples were given heat treatment by precipitation hardening (aging) at temperature 120°C for 24 hours, so it becomes 7075-T6 Al alloy. Samples were subjected to some mechanical tests and the morphology of the resulting microstructures were characterized by optical microscopy. The …
Microstructure Of Electrodeposited Copper Foil: Discussion On The Mechanism Model Of Three-Dimensional Electrocrystallization, Ren-Zhi Liu, Ping-Ling Xie, Chong Wang
Microstructure Of Electrodeposited Copper Foil: Discussion On The Mechanism Model Of Three-Dimensional Electrocrystallization, Ren-Zhi Liu, Ping-Ling Xie, Chong Wang
Journal of Electrochemistry
The manufacturing of electrolytic copper foil has attracted more and more attention with the extensive applications of printed circuit board and lithium battery. The industrial scale is still extending. Compared with the developments of electroplating equipment and electroplating process, there is limited research on the mechanism of electrodeposition. This paper summarizes the manufacturing process of electrodeposited copper foil and analyzes the differences of various electroplating parameters in different electrodeposited copper technologies, and points out the important role of electrodeposition current density in the formation of copper foil. By showing and comparing the microstructures of different electrodeposited copper foils, the influences …