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Selective Electroless Copper Plating Micro-Pattern On Ceramics Without Sensitisation And Activation, Zhen-Lin Xu
Selective Electroless Copper Plating Micro-Pattern On Ceramics Without Sensitisation And Activation, Zhen-Lin Xu
Journal of Electrochemistry
The purpose of this article is to provide a new technology of electroless copper plating without palladium activation steps. By combining the technology of laser micro-etching with the new copper-plating bath, copper plating on ceramics was obtained. The experimental results showed that the solution used for copper electroless plating was stable and the copper coating obtained was bright,dense with good electrical conductivity.The line definition was about 40 μm. The electroless Cu films deposited from this system were gentle and required simple operating conditions.