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Thermoelectric Module-Variable Conductance Heat Pipe Assemblies For Reduced Power Temperature Control, Corey Melnick, Marc Hodes, Gennady Ziskind, Martin Cleary, Vincent Manno
Thermoelectric Module-Variable Conductance Heat Pipe Assemblies For Reduced Power Temperature Control, Corey Melnick, Marc Hodes, Gennady Ziskind, Martin Cleary, Vincent Manno
Vincent P. Manno
Thermoelectric modules (TEMs) are used to precisely maintain the setpoint temperature of photonic components generating variable heat loads under varying ambient conditions. The non-component side of TEMs is mounted onto conventional heat sinks (CHSs). At any combination of setpoint temperature, heat load and ambient temperature, there is a unique thermal resistance between the non-component side of a TEM and the ambient corresponding to minimal TEM power consumption. Indeed, a zero thermal resistance heat sink minimizes power consumption when a TEM operates in refrigeration mode, but when it operates in heating mode a relatively high thermal resistance one is optimal. This …
Optimized Thermoelectric Module-Heat Sink Assemblies For Precision Temperature Control, Rui Zhang, David Brooks, Marc Hodes, Vincent Manno
Optimized Thermoelectric Module-Heat Sink Assemblies For Precision Temperature Control, Rui Zhang, David Brooks, Marc Hodes, Vincent Manno
Vincent P. Manno
Robustprecision temperature control of photonics components is achieved by mountingthem on thermoelectric modules (TEMs) which are in turn mountedon heat sinks. However, the power consumption of TEMs ishigh because high currents are driven through Bi2Te3-based semiconducting materialswith high electrical resistivity and finite thermal conductivity. This problemis exacerbated when the ambient temperature surrounding a TEM variesin the usual configuration where the air-cooled heat sink aTEM is mounted to is of specified thermal resistance. Indeed,heat sinks of negligible and relatively high thermal resistances minimizeTEM power consumption for sufficiently high and low ambient temperatures,respectively. Optimized TEM-heat sink assemblies reduce the severity of thisproblem. …
Measurement Of Microscale Shear Forces During Chemical Mechanical Planarization, Robert White, Andrew Mueller, Minchul Shin, Douglas Gauthier, Vincent Manno, Chris Rogers
Measurement Of Microscale Shear Forces During Chemical Mechanical Planarization, Robert White, Andrew Mueller, Minchul Shin, Douglas Gauthier, Vincent Manno, Chris Rogers
Vincent P. Manno
Polydimethylsiloxane (PDMS) posts with a diameter of 80 mu m were used to measure the shearing forces at the wafer-pad interface during chemical mechanical planarization (CMP). Measurements are made at 10 kHz with measurable forces between 40 and 400 mu N. The structures were polished using a stiff, ungrooved pad and 3 wt % fumed silica slurry at velocities of 0.3 and 0.6 m/s and average wafer-pad normal load of 5.0 and 9.1 kPa. Due to the small fraction of the pad that contacts the wafer, the local microscale forces can be much larger than the global average force might …