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Constant Interface Temperature Reliability Assessment Method: An Alternative Method For Testing Thermal Interface Material In Products, Christian Amoah-Kusi

Dissertations and Theses

As electronic packages and their thermal solutions become more complex the reliability margins in the thermal solutions diminish and become less tolerant to errors in reliability predictions. The current method of thermally stress testing thermal solutions can be over or under predicting end of life thermal performance. Benefits of accurate testing and modeling are improved silicon yield in manufacturing, improved performance, lower cost thermal solutions, and shortened test times.

The current method of thermally stress testing is to place the entire unit in an elevated isothermal temperature and periodically measure thermal performance. Isothermally aging is not an accurate representation of …