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Diamond Coated Wire Cutting Of Solar Si Ingots: New Insights Using Raman Microspectroscopy, Junting Yang
Diamond Coated Wire Cutting Of Solar Si Ingots: New Insights Using Raman Microspectroscopy, Junting Yang
McKelvey School of Engineering Theses & Dissertations
Diamond embedded abrasive wire (henceforth called diamond wire) sawing process of Si is a highly efficient technique for rapid wafering of solar Si ingots. However, the root causes for cutting efficiency losses are unknown. One approach to understanding this complex process is to study 1) diamond particles on diamond coated wire (DCW) and 2) Si swarf collected during cutting process. In this thesis, we use confocal, micro Raman spectroscopy to unravel loss mechanisms of wafer sawing efficiency.
In the first part, we analyze the diamond microparticles which perform the sawing. By analyzing the phase transformation and stress distribution on single …