Engineering Commons^™

Synthesis And Characterization Of Phosphosilicate Glass Films By Lpcvd For Sensor Application, Hui Wu

Theses

This study was dedicated to the synthesis of the thin film materials required to fabricate the waveguide and the reference arm barrier for integrated optical sensor. Phosphosilicate glass (PSG) thin films were synthesized on silicon and quartz wafers by LPCVD using Ditertiarybutylsilane(DTBS), Trimethylphosphite(TMP) and oxygen as precursors. The films were processed at different temperatures between 600°C and 700°C at a constant pressure, and at different flow rate of TMP.

The effect of TMP flow rate and deposition temperature on deposition parameters and the properties of PSG films were investigated. The films deposited were uniform, amorphous, low stress and the composition …

Relaxation And The Nature Of Electrical Stress Related Defects In Ultra-Thin Dioxide On Silicon, Lihui Xie

Theses

The instability of defects created in ultra-thin insulator, metal-oxide-silicon devices biased in the direct tunnel regime is investigated. For the case of electron injection from the silicon substrate, nearly complete defect relaxation is observed after the bias is removed, allowing the possibility of re-generating the defects. Modeling the defect generation process and examining differences between initial and subsequent degradation periods lead to an improved picture of both the relaxation process and the nature of the involved defects.

Synthesis And Characterization Of Hafnium Carbide Thin Films, Wiriya Thongruang

Theses

Hafnium carbide thin films of various characteristics were deposited on silicon substrates using dc magnetron sputtering. A HfC target was used as a sputtering source and Ar was used as a sputtering gas during deposition. The variables investigated were total sputtering gas pressure and power. Optimum characteristics were achieved with a total sputtering gas pressure of 5 mTorr and power of 200 W. No evidence for oxidation of the film was found at a depth below 400A for deposited and annealed films. Binding characteristics were obtained from ESCA data. The compressive film stress increased when sputtering gas pressure decreased. The …