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Materials Science and Engineering

Missouri University of Science and Technology

Economics Faculty Research & Creative Works

Series

Articles 1 - 9 of 9

Full-Text Articles in Engineering

Nanofibrous Articles, Gene Kim, Bonnie Bachman, Stephen O. Bozzone Jan 2007

Nanofibrous Articles, Gene Kim, Bonnie Bachman, Stephen O. Bozzone

Economics Faculty Research & Creative Works

Nanofibrous articles can be manufactured by a process that includes preparation of a surface of a substrate to provide an adhesion mechanism for securing the nanofibers to the surface. The nanofibers can be dispersed in an area near the substrate for the purpose of being adhered to the surface. If an ordered arrangement of nanofibers is required, an electric field can be provided in the area where the nanofibers are dispersed to selectively control an ordering of the nanofibers as they are adhered to the surface by the adhesion mechanism.


Method And Apparatus For Solder-Less Attachment Of An Electronic Device To A Textile Circuit, James A. Zollo, Bonnie Bachman, Alan R. Beatty, Stephen O. Bozzpme, Nitin B. Desai, Ronald J. Kelley, Rami C. Levy Apr 2006

Method And Apparatus For Solder-Less Attachment Of An Electronic Device To A Textile Circuit, James A. Zollo, Bonnie Bachman, Alan R. Beatty, Stephen O. Bozzpme, Nitin B. Desai, Ronald J. Kelley, Rami C. Levy

Economics Faculty Research & Creative Works

A method and apparatus form electrical connections between electronic circuits and conductive threads (102, 104, 106, 108) that are interwoven into textile material (130). Electronic circuits (128), such as semiconductor dies, are connected to a carrier (132) and electrical connections (136) are made to conductive connection areas (110, 112, 114, 116) on the carrier (132). Conductive stitching (202, 204, 206, 208) provides electrical contacts for both the conductive connection areas (110, 112, 114, 116) on the carrier (132) and the conductive threads (102, 104, 106, 108) that are interwoven into the textile material (130). Optionally, a thin, flexible substrate material …


Method And System For Electronically Generating Random Answers, Stephen O. Bozzone, Bonnie Bachman Dec 2005

Method And System For Electronically Generating Random Answers, Stephen O. Bozzone, Bonnie Bachman

Economics Faculty Research & Creative Works

The invention concerns a method (300) and system (110) for electronically generating random responses in a portable electronic device (110). The method includes the steps of detecting (316) motion of the portable electronic device, in response to the detecting step, generating (318) the random response and outputting (320) the random response to a user of the portable electronic device. The method can further include the steps of prompting (312) the user to ask a question and following a predetermined time period after prompting the user to ask the question, prompting (314) the user to shake the portable electronic device. The …


Modular Communication System, Stephen O. Bozzone, Bonnie Bachman, Ryan Nilsen Aug 2005

Modular Communication System, Stephen O. Bozzone, Bonnie Bachman, Ryan Nilsen

Economics Faculty Research & Creative Works

A modular communication system (10) can include an adaptable communication module (12) having a transceiver (13) coupled to a processor (14) and memory (20), and a first interface block (24) coupled to the processor, and a host device (30) having a power source (36), a user interface (34), and a second interface block (46). The host device can be among a plurality of host devices having different user interfaces and the processor is adaptable to control the different user interfaces when the first interface block recognizes the second interface block. The module can further include a DSP (16) and a …


Artificial Neural Network Modeling Of Rf Mems Resonators, Yongjae Lee, Yonghwa Park, Feng Niu, Bonnie Bachman, K. C. Gupta, Dejan Filipovic Jul 2004

Artificial Neural Network Modeling Of Rf Mems Resonators, Yongjae Lee, Yonghwa Park, Feng Niu, Bonnie Bachman, K. C. Gupta, Dejan Filipovic

Economics Faculty Research & Creative Works

In this article, a novel and efficient approach for modeling radio‐frequency microelectromechanical system (RF MEMS) resonators by using artificial neural network (ANN) modeling is presented. In the proposed methodology, the relationship between physical‐input parameters and corresponding electrical‐output parameters is obtained by combined circuit/full‐wave/ANN modeling. More specifically, in order to predict the electrical responses from a resonator, an analytical representation of the electrical equivalent‐network model (EENM) is developed from the well‐known electromechanical analogs. Then, the reduced‐order, nonlinear, dynamic macromodels from 3D finite‐element method (FEM) simulations are generated to provide training, validating, and testing datasets for the ANN model. The developed ANN …


Milled Carbon Fiber Reinforced Polymer Composition, Brian Massengale, Paul Schauer, Charles Dahle, Barry Gregerson, Bonnie Bachman, Thomas Oesterle Nov 1997

Milled Carbon Fiber Reinforced Polymer Composition, Brian Massengale, Paul Schauer, Charles Dahle, Barry Gregerson, Bonnie Bachman, Thomas Oesterle

Economics Faculty Research & Creative Works

A milled carbon fiber reinforced polymer having increased abrasion resistive characteristics. The reinforced polymer comprises a base resin selected from the group consisting of polyolefins and polyamides. The base resin is combined with an amount of milled carbon fibers and further may be combined with polytetrafluoroethylene. The resulting composite materials have excellent friction and wear characteristics and are useful in the production of injection molded parts. The molded parts have a high impact strength, exhibit dimensional stability, are abrasion resistive, and are static dissipative, with the composite materials having particular utility as support fixtures for semiconductors during certain processing operations.


Method For Fabricating Or Modifying An Article Comprising The Removal Of A Polymer Coating, Bonnie Bachman, Elizabeth A. Hofstatter, Joan M. Ritter, Jerry J. Rubin Aug 1990

Method For Fabricating Or Modifying An Article Comprising The Removal Of A Polymer Coating, Bonnie Bachman, Elizabeth A. Hofstatter, Joan M. Ritter, Jerry J. Rubin

Economics Faculty Research & Creative Works

Disclosed is a method for removing poly-para-xylylene, its derivatives, and copolymers (collectively called "parylene") from bodies, including relatively large bodies such as printed circuit (PC) boards, that is capable of yielding relatively high removal rates. A body such as a PC board coated with parylene is placed into a reaction chamber downstream from a microwave plasma such that plasma discharge products generated by the microwave plasma react with the parylene, etching the parylene without exposing the body to bombardment by energetic ions and/or electrons. The plasma is generated from a gas mixture containing oxygen, a second gas, and optional additives …


Aluminum Deposition On Polyimides: The Effect Of In Situ Ion Bombardment, M. J. Vasile, Bonnie Bachman Sep 1989

Aluminum Deposition On Polyimides: The Effect Of In Situ Ion Bombardment, M. J. Vasile, Bonnie Bachman

Economics Faculty Research & Creative Works

The chemistry of the Al polyimide interface is examined by x‐ray photoelectron spectroscopy sputter profiling. Al deposited on polyimide films without an in situ Ar backsputter shows a clearly defined 50‐Å Al2O3 layer just prior to the polyimide. This layer is identified by the O/Al atom ratio at 1.5, and the binding energy of the Al 2p transition. There is a clear separation of the Al/Al2O3/polyimide layers in the sputter profiles. Deposition of Al on polyimide surfaces after Argon backsputtering produces a diffuse Al/polyimide interface with no Al2O3 present. There …


Ion Bombardment Of Polyimide Films, Bonnie Bachman, M. J. Vasile Jul 1989

Ion Bombardment Of Polyimide Films, Bonnie Bachman, M. J. Vasile

Economics Faculty Research & Creative Works

Surface modification techniques such as wet chemical etching, oxidizing flames, and plasma treatments (inert ion sputtering and reactive ion etching) have been used to change the surface chemistry of polymers and improve adhesion. With an increase in the use of polyimides for microelectronic applications, the technique of ion sputtering to enhance polymer‐to‐metal adhesion is receiving increased attention. For this study, the argon‐ion bombardment surfaces of pyromellitic dianhydride and oxydianiline (PMDA–ODA) and biphenyl tetracarboxylic dianhydride and phenylene diamine (BPDA–PDA) polyimide films were characterized with x‐ray photoelectron spectroscopy (XPS) as a function of ion dose. Graphite and high‐density polyethylene were also examined …