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Materials Science and Engineering
Materials Science and Engineering Faculty Publications and Presentations
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- BRC (4)
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- EBSD (1)
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- Hafnium oxide (HfO2) (1)
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- IC stacking (1)
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Articles 1 - 6 of 6
Full-Text Articles in Engineering
Programmable Periodicity Of Quantum Dot Arrays With Dna Origami Nanotubes, Hieu Bui, Craig Onodera, Carson Kidwell, Yerpeng Tan, Elton Graugnard, Wan Kuang, Jeunghoon Lee, William B. Knowlton, Bernard Yurke, William L. Hughes
Programmable Periodicity Of Quantum Dot Arrays With Dna Origami Nanotubes, Hieu Bui, Craig Onodera, Carson Kidwell, Yerpeng Tan, Elton Graugnard, Wan Kuang, Jeunghoon Lee, William B. Knowlton, Bernard Yurke, William L. Hughes
Materials Science and Engineering Faculty Publications and Presentations
To fabricate quantum dot arrays with programmable periodicity, functionalized DNA origami nanotubes were developed. Selected DNA staple strands were biotin-labeled to form periodic binding sites for streptavidin-conjugated quantum dots. Successful formation of arrays with periods of 43 and 71 nm demonstrates precise, programmable, large-scale nanoparticle patterning; however, limitations in array periodicity were also observed. Statistical analysis of AFM images revealed evidence for steric hindrance or site bridging that limited the minimum array periodicity.
Kinetics Of Dna And Rna Hybridization In Serum And Serum-Sds, Elton Graugnard, Amber Cox, Jeunghoon Lee, Cheryl Jorcyk, Bernard Yurke, William L. Hughes
Kinetics Of Dna And Rna Hybridization In Serum And Serum-Sds, Elton Graugnard, Amber Cox, Jeunghoon Lee, Cheryl Jorcyk, Bernard Yurke, William L. Hughes
Materials Science and Engineering Faculty Publications and Presentations
Cancer is recognized as a serious health challenge both in the United States and throughout the world. While early detection and diagnosis of cancer leads to decreased mortality rates, current screening methods require significant time and costly equipment. Recently, increased levels of certain micro-ribonucleic acids (miRNAs) in the blood have been linked to the presence of cancer. While blood-based biomarkers have been used for years in cancer detection, studies analyzing trace amounts of miRNAs in blood and serum samples are just the beginning. Recent developments in deoxyribonucleic acid (DNA) nanotechnology and DNA computing have shown that it is possible to …
Limitations Of Poole–Frenkel Conduction In Bilayer Hfo2/Sio2 Mos Devices, Richard G. Southwick Iii, Justin Reed, Christopher Buu, Ross Butler, Gennadi Bersuker, William B. Knowlton
Limitations Of Poole–Frenkel Conduction In Bilayer Hfo2/Sio2 Mos Devices, Richard G. Southwick Iii, Justin Reed, Christopher Buu, Ross Butler, Gennadi Bersuker, William B. Knowlton
Materials Science and Engineering Faculty Publications and Presentations
The gate leakage current of metal–oxide– semiconductors (MOSs) composed of hafnium oxide (HfO2) exhibits temperature dependence, which is usually attributed to the standard Poole–Frenkel (P–F) transport model. However, the reported magnitudes of the trap barrier height vary significantly. This paper explores the fundamental challenges associated with applying the P–F model to describe transport in HfO2/SiO2 bilayers in n/p MOS field-effect transistors composed of 3- and 5-nm HfO2 on 1.1-nm SiO2 dielectric stacks. The extracted P–F trap barrier height is shown to be dependent on several variables including the following: the temperature range, method …
Recent Advances In High Density Area Array Interconnect Bonding For 3d Integration, J. M. Lannon, J., C. Gregory, M. Lueck, A. Huffman, D. Temple, Amy J. Moll, William B. Knowlton
Recent Advances In High Density Area Array Interconnect Bonding For 3d Integration, J. M. Lannon, J., C. Gregory, M. Lueck, A. Huffman, D. Temple, Amy J. Moll, William B. Knowlton
Materials Science and Engineering Faculty Publications and Presentations
The demand for more complex and multifunctional micro systems with enhanced performance characteristics for military applications is driving the electronics industry toward the use of best-of-breed materials and device technologies. Threedimensional (3-D) integration provides a way to build complex microsystems through bonding and interconnection of individually optimized device layers without compromising system performance and fabrication yield. Bonding of device layers can be achieved through polymer bonding or metal-metal interconnect bonding with a number of metalmetal systems. RTI has been investigating and characterizing Cu-Cu and CulSn-Cu processes for high density area array imaging applications, demonstrating high yield bonding between sub-I5 11m …
Effects Of Crystallographic Orientation On The Early Stages Of Oxidation In Nickel And Chromium, Louis P. Bonfrisco, Megan Frary
Effects Of Crystallographic Orientation On The Early Stages Of Oxidation In Nickel And Chromium, Louis P. Bonfrisco, Megan Frary
Materials Science and Engineering Faculty Publications and Presentations
Surface orientation plays an important role in the oxidation behavior of single crystals where studies have found the relative oxidation rates for surfaces with different orientations. However, most materials are polycrystalline and contain myriad orientations that contribute to the overall oxidation process. Here we determine the effects of orientation on the early stages of oxidation behavior as a function of surface orientation for polycrystalline nickel (face-centered cubic) and chromium (body-centered cubic). After high temperature oxidation, the oxide topography is characterized using optical profilometry and the underlying microstructure is characterized with electron backscatter diffraction (EBSD). By correlating results from EBSD and …
Microstructural Effects During Chemical Mechanical Planarization Of Copper, Patrick J. Andersen, Mariela N. Bentancur, Amy J. Moll, Megan Frary
Microstructural Effects During Chemical Mechanical Planarization Of Copper, Patrick J. Andersen, Mariela N. Bentancur, Amy J. Moll, Megan Frary
Materials Science and Engineering Faculty Publications and Presentations
Novel die-stacking schema using through-wafer interconnects require vias to be filled with electroplated Cu, resulting in thick copper films, and requiring an aggressive first-step CMP. This work investigates the effects of microstructure on CMP of copper films, which are not presently well understood. Bulk and local removal rates were investigated for several different microstructures. Surface orientation maps were created and the orientations of individual grains were correlated with topographical data to elucidate local removal behavior. Cu removal depends on the details of the microstructure, and certain microstructures allowed for either faster or more uniform removal of thick Cu films.