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Improved Predictive Modeling Techniques For Non-Linear Solder Material Behavior, Arman Millian Ahari

Dissertations and Theses

Accurate prediction of fatigue life of solder joints in electronic packaging applications becomes of critical importance as semiconductor device technology and manufacturing constraints grow in complexity. To gain visibility on IC device performance and reliability, thermo-mechanical simulation is performed based on a unified, viscoplastic material model, which is dependent on nine parameters.

In this study, an improved method of Anand parameter extraction, which involves curve-fitting non-linear experimental stress data, is proposed to improve the accuracy of numerical predictions for solder reliability. Theoretical equations for uni-axial stress-strain response and creep response are derived, then details on their relevance to experimental and …