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Full-Text Articles in Engineering
Reactive Infiltration Of Silicon Melt Through Microporous Amorphous Carbon Preforms, P. Sangsuwan, Surendra N. Tewari, Jorge E. Gatica, M. Singh, R. Dickerson
Reactive Infiltration Of Silicon Melt Through Microporous Amorphous Carbon Preforms, P. Sangsuwan, Surendra N. Tewari, Jorge E. Gatica, M. Singh, R. Dickerson
Chemical & Biomedical Engineering Faculty Publications
The kinetics of unidirectional capillary infiltration of silicon melt into microporous carbon preforms has been investigated as a function of the pore morphology and melt temperature. The infiltrated specimens showed alternating bands of dark and bright regions, which corresponded to the unreacted free carbon and free silicon regions, respectively. The decrease in the infiltration front velocity for increasing infiltration distances is in qualitative agreement with the closed-form solution of capillarity-driven fluid flow through constant-cross-section cylindrical pores. However, drastic changes in the thermal response and infiltration front morphologies were observed for minute differences in the preform's microstructure. This suggests the need …
Cellular/Dendritic Array Tip Morphology During Directional Solidification Of Pb-5.8 Wt Pct Sb Alloy, L. Yu, G. L. Ding, J. Reye, S. N. Ojha, Surendra N. Tewari
Cellular/Dendritic Array Tip Morphology During Directional Solidification Of Pb-5.8 Wt Pct Sb Alloy, L. Yu, G. L. Ding, J. Reye, S. N. Ojha, Surendra N. Tewari
Chemical & Biomedical Engineering Faculty Publications
Cellular/dendritic array tip morphology has been examined in directionally solidified and quenched Pb-5.8 wt pet Sb alloy by a serial sectioning and three-dimensional image reconstruction technique. There is a large scatter in the tip radius, the nearest neighbor spacing, and the mushy zone length, even among the immediately neighboring cells and dendrites. This scatter may be caused by the natural convection (in the mushy zone and in the bulk melt at the array tip), which also produces macrosegregation along the length of the directionally solidified samples. Even in the presence of convection, however, the tip radii are observed to be …
Macrosegregation Caused By Thermosolutal Convection During Directional Solidification Of Pb-Sb Alloys, S. N. Ojha, G. L. Ding, Y. Lu, J. Reye, Surendra N. Tewari
Macrosegregation Caused By Thermosolutal Convection During Directional Solidification Of Pb-Sb Alloys, S. N. Ojha, G. L. Ding, Y. Lu, J. Reye, Surendra N. Tewari
Chemical & Biomedical Engineering Faculty Publications
Pb-2.2 and 5.8 wt pet Sb alloys were directionally solidified with a positive thermal gradient of 140 K cm(-1) at growth speeds ranging from 0.8 to 30 mu m s(-1), and then quenched to retain the mushy-zone morphology. Chemical analysis along the length of the directionally solidified portion and in the quenched melt ahead of the dendritic array showed extensive longitudinal macrosegregation, Cellular morphologies growing at smaller growth speeds are associated with larger amounts of macrosegregation as compared with the dendrites growing at higher growth speeds. Convection is caused, mainly, by the density inversion in the overlying melt ahead of …
Cell/Dendrite Distribution In Directionally Solidified Hypoeutectic Pb-Sb Alloys, S. P. O'Dell, G. L. Ding, Surendra N. Tewari
Cell/Dendrite Distribution In Directionally Solidified Hypoeutectic Pb-Sb Alloys, S. P. O'Dell, G. L. Ding, Surendra N. Tewari
Chemical & Biomedical Engineering Faculty Publications
The alloys Pb-2.2 wt pet Sb and Pb-5.8 wt pet Sb were directionally solidified with three different thermal gradients of 40, 86, and 140 K cm(-1) at growth rates ranging from 0.6 to 30 mu m s(-1). A Gaussian peak amplitude analysis of the cell/dendrite spacing distribution shows a distinct peak corresponding to the nearest neighbors. The peaks corresponding to the second and the third nearest neighbor spacings are also brought out by this technique. The ratios of the second to the first nearest neighbor spacings and that of the third to the first neighbor spacings are 1.85 +/-: 0.11 …
Copper Alloy-Impregnated Carbon-Carbon Hybrid Composites For Electronic Packaging Applications, S. K. Datta, Surendra N. Tewari, Jorge E. Gatica, W. Shih, L. Bentsen
Copper Alloy-Impregnated Carbon-Carbon Hybrid Composites For Electronic Packaging Applications, S. K. Datta, Surendra N. Tewari, Jorge E. Gatica, W. Shih, L. Bentsen
Chemical & Biomedical Engineering Faculty Publications
Porous carbon-carbon preforms, based on three-dimensional networks of PAN (Polyacrylonitrile)-based carbon fibers and various volume fractions of chemical vapor-deposited (CVD) carbon, were impregnated by oxygen-free, high-conductivity (OFHC) Cu, Cu-6Si-0.9Cr, and Cu-0.3Si-0.3Cr (wt pct) alloys by pressure infiltration casting. The obtained composites were characterized for their coefficient of thermal expansion (CTE) and thermal conductivity (K) along the through-thickness and two in-plane directions. One composite, with a 28 vol pct Cu-0.3Si-0.3Cr alloy, showed outstanding potential for thermal management applications in electronic applications. This composite exhibited approximately isotropic thermal expansion properties (CTE = 4 to 6.5 ppm/K) and thermal conductivities (k greater than …