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Materials Chemistry

Journal of Electrochemistry

2002

Ceramic

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Full-Text Articles in Engineering

Pure Hap Film Prepared By Direct Electrodepositing On Metallic Surface And Its Mechanism, Hao-Bing Hu, Chang-Jian Lin, Fei Chen, Ren Hu, Ming Guo Aug 2002

Pure Hap Film Prepared By Direct Electrodepositing On Metallic Surface And Its Mechanism, Hao-Bing Hu, Chang-Jian Lin, Fei Chen, Ren Hu, Ming Guo

Journal of Electrochemistry

In controlling concentration of Ca 2+ and PO 4 3- in electrodeposition solution, the HAP film on Ti alloy has been deposited directly. Using XRD and SEM we have learned that prepared HAP is intact in crystal and equal in dimension. Thermodynamic calculation indicated that the HAP is easer formation of than that TCP of. With the XRD, SEM analyses and thermodynamic calculation, the electrodeposition mechanism has been discussed. It was proved that electrodepositon is a two_stage process and formation of HAP is a direct process from solution ions to HAP crystal without precursor.