Engineering Commons^™

Drop Impact Dynamic Response Study Of Jedec Jesd22-B111 Test Board, Michael Krist, Jianbiao Pan, Andrew Farris, Nicolas Vickers

Industrial and Manufacturing Engineering

Mobile and handheld electronic devices are prone to being dropped. This drop event may result in failure of solder joints inside these devices. The need for RoHS compliant boards coupled with the demand for reliable electronics has resulted in the development of the JEDEC Standard JESD22-B111 to standardize the method of drop testing surface mount electronic components. However, there has been little study on the effects of additional mass on the board and rigidity of the board on drop test reliability. This paper examines the drop impact dynamic responses of the JEDEC JESD22-B111 board. Of interest are the effects of …

Board Level Failure Analysis Of Chip Scale Package Drop Test Assemblies, Nicholas Vickers, Kyle Rauen, Andrew Farris, Jianbiao Pan

Industrial and Manufacturing Engineering

This paper presents the failure analysis results of board level drop tests. In this study, the test vehicle was designed according to the requirements of the Joint Electron Device Engineering Council (JEDEC) drop test board. The test vehicle was assembled with 15 chip scale packages (CSPs) each having 228 daisy-chained 0.5 mm pitch solder joints using Sn-3.0 wt% Ag-0.5 wt% Cu (SAC305) lead free solder. Assemblies were drop tested using three different peak accelerations of 900 G, 1500 G, 2900 G, with 0.7 ms, 0.5 ms, and 0.3 ms pulse durations, respectively. Scanning electron microscopy (SEM) with energy dispersive spectroscopy …

The Effect Of Ultrasonic Frequency On Gold Wire Bondability And Reliability, Jianbiao Pan, Minh-Nhat Le, Cuong Van Pham

Industrial and Manufacturing Engineering

This paper presents a systematic study on the effect of 120KHz ultrasonic frequency on the bondability and reliability of fine pitch gold wire bonding. The study was carried out on a thermosonic ball bonder that is allowed to easily switch between ultrasonic frequency of 60KHz and 120 KHz by changing the ultrasonic transducer and the ultrasonic generator. Bonding parameters were optimized through design of experiment methodology for four different cases: 25.4 μm wire at 60 kHz, 25.4 μm wire at 120 kHz, 17.8 μm wire at 60 kHz, and 17.8 μm wire at 120 kHz. The integrity of wire bonds …

Work In Progress - Enhancing Student-Learning Through State-Of-The-Art Systems Level Design And Implementation, Albert A. Liddicoat, Jianbiao Pan, James G. Harris, Dominic J. Dal Bello, Lynne A. Slivovsky

Industrial and Manufacturing Engineering

The curriculum for undergraduate engineering programs is often partitioned into several courses that are taught in isolation followed by a single culminating senior design or capstone project experience. In the senior design class students being to synthesize the knowledge and skills that they acquired through the engineering curriculum. This paper presents lower and upper division course and curricular changes made to accommodate learning objectives that better prepare students for project-based learning. These learning experiences and skills include: systems level design, experience with state-of-the-art Computer Aided Design (CAD) tools, printed circuit board (PBC) design, design for manufacturability, electronics assembly, project management, …

Alternative Binder Carbide Tools For Machining Superalloys, Daniel J. Waldorf, Michael Stender, Scott Liu, Daniel Norgan

Industrial and Manufacturing Engineering

This study examines the performance of a new class of wear-resistant but economical cutting tools produced by varying the binder composition of standard cemented carbide composites. By replacing some or all of the cobalt binder with rhenium and nickel-based superalloy, a stronger composite tool results, potentially capable of machining heat-resistant superalloys at significantly higher cutting speeds. Sample tools with alternative binder were produced and compared to standard tools bound with cobalt only. Turning experiments on Inconel 718 were run to evaluate wear resistance and tool life for several grades. The experimentation also examined the effects of varying the relative proportions …

Microstructural Characterization Of Diode Laser Deposited Ti-6al-4v, Tian Fu, Zhiqiang Fan, Syamala R. Pulugurtha, Todd E. Sparks, Jianzhong Ruan, Frank W. Liou, Joseph William Newkirk

Mechanical and Aerospace Engineering Faculty Research & Creative Works

Laser Direct Metal Deposition (DMD) is an effective approach to manufacturing or repairing a range of metal components. The process is a layer-by-layer approach to building up a three dimensional solid object. The microstructure influences mechanical properties of the deposited parts. Thus, it is important to understand the microstructural features of diode laser deposited parts. This paper presents a microstructure analysis of a diode laser deposited Ti-6Al-4V onto a Ti-6Al-4V substrate. laser deposited parts. This paper presents a microstructure analysis of a diode laser deposited Ti-6Al-4V onto a Ti-6Al-4V substrate.

Freeform Fabrication Of Zirconium Diboride Parts Using Selective Laser Sintering, Ming-Chuan Leu, Erik B. Adamek, Tieshu Huang, Greg Hilmas, Fatih Dogan

Mechanical and Aerospace Engineering Faculty Research & Creative Works

Using the Selective Laser Sintering (SLS) process, both flexural test bars and 3D fuel injector components have been fabricated with zirconium diboride (ZrB₂) powder. Stearic acid was selected as the binder. Values of SLS process parameters were chosen such that the green parts could be built with sharp geometrical features and that the sintered parts could have good mechanical properties. After binder burnout and sintering, the SLS fabricated ZrB₂ test bars achieved 80% theoretical density, and the average flexural strength of the sintered samples was 195 MPa. These values demonstrate the feasibility of the SLS process for …

Direct 3d Layer Metal Deposition, Jianzhong Ruan, Lie Tang, Todd E. Sparks, Robert G. Landers, Frank W. Liou

Mechanical and Aerospace Engineering Faculty Research & Creative Works

Multi-axis slicing for solid freeform fabrication (SFF) manufacturing processes can yield non-uniform thickness layers, or 3D layers. Using the traditional parallel layer construction approach to build such a layer leads to a staircase which requires machining or other post processing to form the desired shape. This paper presents a direct 3D layer deposition approach. This approach uses an empirical model to predict the layer thickness based on experimental data. The toolpath between layers is not parallel; instead, it follows the final shape of the designed geometry and the distance between the toolpath in the adjacent layers varies at different locations. …

Direct-To-Part Machining Waste Recycling Using Laser Metal Deposition, Todd E. Sparks, Frank W. Liou

Mechanical and Aerospace Engineering Faculty Research & Creative Works

Laser metal deposition typically uses metal powders as the build material of choice. The ability to reprocess waste materials using this technology would significantly reduce the material cost and cradle-to-grave energy content of parts produced using these methods. This capability will also greatly increase the utility of laser deposition, to potential industrial uses. This paper explores the usage of machining chips as an alternate source of build material. Topics covered include material handling, material preprocessing, and comparison to powder- based deposition.

Layer-To-Layer Height Control For Laser Metal Deposition Processes, Lie Tang, Jianzhong Ruan, Todd E. Sparks, Robert G. Landers, Frank W. Liou

Mechanical and Aerospace Engineering Faculty Research & Creative Works

A Laser Metal Deposition (LMD) height controller design methodology is presented in this paper. The height controller utilizes the Particle Swarm Optimization (PSO) algorithm to estimate model parameters between layers using measured temperature and track height profiles. The process model parameters for the next layer are then predicted using Exponentially Weighted Moving Average (EWMA). Using the predicted model, the powder flow rate reference profile, which will produce the desired layer height reference, is then generated using Iterative Learning Control (ILC). The model parameter estimation capability is tested using a four-layer deposition. The results demonstrate the simulation based upon estimated process …

Modeling And Experimental Results Of Concentration With Support Material In Rapid Freeze Prototyping, Frances D. Bryant, Ming-Chuan Leu

Mechanical and Aerospace Engineering Faculty Research & Creative Works

Ice structures with complex geometries and overhung areas are created by the Rapid Freeze Prototyping (RFP) process in a sufficiently cool environment by freezing water into ice as the main material in conjunction with a eutectic dextrose-water solution as the sacrificial support material. The supported areas in an ice structure are removed via an increase in temperature in a separate environment after the structure is completely fabricated. To understand to what extent these two materials mix during fabrication, two methods of modeling the concentration changes that occur near the interface of the main and support materials have been developed. The …

Product Focused Freeform Fabrication Education, Frank W. Liou, Ming-Chuan Leu

Mechanical and Aerospace Engineering Faculty Research & Creative Works

Presented in this paper is our experience of teaching freeform fabrication to students at the Missouri University of Science and Technology, and to high school students and teachers. The emphasis of the curriculum is exposing students to rapid product development technologies with the goal of creating awareness to emerging career opportunities in CAD/CAM. Starting from solid modeling, principles of freeform fabrication, to applications of rapid prototyping and manufacturing in industry sponsored product development projects, students can learn in-depth freeform fabrication technologies. Interactive course content with hands-on experience for product development is the key towards the success of the program.

Enhancing Student Learning Through State-Of-The-Art Systems Level Design And Implementation: The Development Of A Lower Division Learning Module, James G. Harris, Dominic Dal Bello, Jianbiao Pan, Albert Liddicoat

Industrial and Manufacturing Engineering

The Cal Poly/Allan Hancock team is developing a learning module that will allow all lower division engineering students to design, fabricate, assemble, and test an electronic system implemented on a printed circuit board (PCB). All the services necessary to perform this laboratory experiment will be provided with low-cost vendors available on the . The learning module is being developed so that it can be integrated into the existing electrical engineering lower division courses that are required by all engineering students. The laboratory learning module will use operational amplifiers (op amp), resistors, capacitors and other common electronic components to study the …

Curricular Enhancement To Support Project-Based Learning In Computer And Electrical Engineering, Albert Liddicoat, Jianbiao Pan, James G. Harris, Lynne A. Slivovsky

Industrial and Manufacturing Engineering

Undergraduate computer and electrical engineering programs often partition the curriculum into several courses based on related topics taught in isolation. Students are expected to synthesize their knowledge in a senior design project. It is the authors’ experience that students often struggle during their senior design project since they have not gained the appropriate knowledge or mastered necessary skills needed to work on a significant or team-based engineering design project. Specifically, students need to be able to define system requirements, partition the design into subcomponents, design, build, test, and verify that the system requirements have been met. The authors have enhanced …

A Project-Based Electronics Manufacturing Laboratory Course For Lower-Division Engineering Students, Jianbiao Pan, Albert Liddicoat, James G. Harris, Dominic Dal Bello

Industrial and Manufacturing Engineering

This paper presents a project-based laboratory course on electronics design and manufacturing. The goal of this course is to provide lower-division engineering students a hands-on experience involving actual printed circuit board (PCB) design, layout, fabrication, assembly, and testing. Through project-based learning, students not only learn technical skills in designing and manufacturing an electronic device, but also develop their project management and communication skills early in their course of study at the university. The course outline and examples of the student projects are presented in this paper as well as project evaluations and students’ feedback. This paper also presents the selection …

Techniques For Developing Large Scale Fuzzy Logic Systems, Jon C. Ervin, Sema E. Alptekin

Industrial and Manufacturing Engineering

In this paper, we describe various techniques used to make Intuitionistic Fuzzy Logic Systems amenable to operating on applications with large numbers of inputs. A rule reduction technique known as Combs method is combined with an automated tuning process based on Particle Swarm Optimization. A second stage of tuning on rule weights results in improved performance and further reduction in the size of the rule-base. The entire process has been developed to operate within the Matlab software environment. The technique is tested against the Wisconsin Breast Cancer Database. The use of these tools shows great promise in significantly expanding the …

Drop Test Reliability Of Lead-Free Chip Scale Packages, Andrew Farris, Jianbiao Pan, Albert Liddicoat, Brian J. Toleno, Dan Maslyk, Dongkai Shangguan, Jasbir Bath, Dennis Willie, David A. Geiger

Industrial and Manufacturing Engineering

This paper presents the drop test reliability of 0.5 mm pitch lead-free chip scale packages (CSPs). Fifteen 0.5 mm pitch CSPs were assembled on a standard JEDEC drop reliability test board with Sn3.0Ag0.5Cu lead-free solder. Eight boards were edge-bonded with a UV-cured acrylic; eight boards were edge- bonded with a thermal-cured epoxy; and twelve boards were assembled without edge bonding. Half of the edge-bonded test boards were subjected to drop tests at a peak acceleration of 1500 G with a pulse duration of 0.5 ms, and the other half subjected to drop tests at a peak acceleration of 2900 G …

Force Measurement And Evaluation For Surgical Cutting Applications: Development Of An Effective Characterisation Testbed, Dean Callaghan

Conference Papers

Sensorized instruments that cater for accurate measurement of the interaction forces (between biological tissue and instrument end-effector) during surgical procedures offer surgeons a greater sense of immersion during minimally invasive robotic surgery (MIRS). There is much ongoing research into force measurement/evaluation involving surgical graspers. However, comparatively little corresponding effort has been expended in the measurement and subsequent evaluation of forces between scissor blades and tissue. This paper presents the design and development of a force/strain measurement test apparatus, which will ultimately serve as an effective sensor characterisation and evaluation platform. Data acquired from the testing platform can be used to …

Preparation And Accreditation Of Level 7 Engineering Programmes, Mark Mcgrath

Conference Papers

Accreditation of 3^rd level educational programmes by a suitably recognised professional body is of particular relevance in relation to engineering. The completion of a sequence of modules which leads to the attainment of this professionally recognised award is viewed as integral to the undertaking. The engineering technology fields are developing and expanding rapidly and the third level sector must keep abreast of these changes. This is essential if the third level institutions wish to continue delivering programmes which produce graduates who can successfully complete the transition from 3rd. Level to the various engineering sectors.

This paper outlines various aspects …

Design Issues For Therapeutic Ultrasound Angioplasty Waveguides, Declan Noone, Graham Gavin, Garrett Mcguinness

Conference Papers

Therapeutic ultrasound angioplasty is a new minimally invasive cardiovascular procedure for disrupting atherosclerotic lesions. Mechanical energy is transmitted in the form of ultrasound waves via long, flexible wire waveguides navigated to the lesion site through the vascular system. The underpinning principle of this technology is that plaque may be disrupted through a combination of direct contact ablation, pressure waves, cavitation and acoustic streaming, which all depend on the amplitude and frequency of displacements at the distal tip of the wire waveguide. This study identifies a number of key design issues for clinical devices of this type, and describes testing procedures …