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Gold Contamination In Non-Lead Surface Mount Solder Joints, Richard Alexander Garrison
Gold Contamination In Non-Lead Surface Mount Solder Joints, Richard Alexander Garrison
Industrial and Manufacturing Engineering
Abstract
Solder joints are critical to the reliability of circuit boards. If gold is introduced to the solder joint, brittle AuSn4 intermetallic compounds develop which affect reliability of that solder joint. To determine the effects of gold when dissolved into a non-lead solder joint, a process was developed in order to apply gold content onto SAC305 solder paste. The gold was transferred as a paste from a micropipette onto each individual solder bump. This process was designed to apply a range of gold content from 1.0 wt. % to 10 wt. % to each individual solder joint. The test board …